Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration

Jianyong Xie; Daehyun Chung; Madhavan Swaminathan; Michael Mcallister; Alina Deutsch; Lijun Jiang; Barry J. Rubin

doi:10.1109/EPEPS.2009.5338465

Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration

Jianyong Xie, Daehyun Chung, Madhavan Swaminathan, Michael Mcallister, Alina Deutsch, Lijun Jiang, Barry J. Rubin

Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

7 Scopus citations

Abstract

In this paper, parameterized electrical-thermal co-analysis for power delivery networks (PDN) in 3D system integration is carried out. A 3D integrated system including glass-ceramic substrate, single and stacked dies, power delivery network, through-silicon vias (TSVs), controlled collapse chip connections (C4s), underfill material, and thermal interface material (TIM) is analyzed with several variable parameters. The analysis results show that temperature effects on DC IR drop can not be neglected. The TIM thermal conductivity, C4 density, stacking order of stacked dies, and voltage source location affect the final IR drop and hot spot temperature in the system.

Original language	English (US)
Title of host publication	2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09
Pages	113-116
Number of pages	4
DOIs	https://doi.org/10.1109/EPEPS.2009.5338465
State	Published - 2009
Event	2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09 - Portland, OR, United States Duration: Oct 19 2009 → Oct 21 2009

Publication series

Name	2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09

Conference

Conference	2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09
Country/Territory	United States
City	Portland, OR
Period	10/19/09 → 10/21/09

All Science Journal Classification (ASJC) codes

Hardware and Architecture
Electrical and Electronic Engineering

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10.1109/EPEPS.2009.5338465

Cite this

Xie, J., Chung, D., Swaminathan, M., Mcallister, M., Deutsch, A., Jiang, L., & Rubin, B. J. (2009). Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration. In 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09 (pp. 113-116). Article 5338465 (2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09). https://doi.org/10.1109/EPEPS.2009.5338465

Xie, Jianyong ; Chung, Daehyun ; Swaminathan, Madhavan et al. / Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration. 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09. 2009. pp. 113-116 (2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09).

@inproceedings{904014538ff84933b88a913ac55d35ed,

title = "Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration",

abstract = "In this paper, parameterized electrical-thermal co-analysis for power delivery networks (PDN) in 3D system integration is carried out. A 3D integrated system including glass-ceramic substrate, single and stacked dies, power delivery network, through-silicon vias (TSVs), controlled collapse chip connections (C4s), underfill material, and thermal interface material (TIM) is analyzed with several variable parameters. The analysis results show that temperature effects on DC IR drop can not be neglected. The TIM thermal conductivity, C4 density, stacking order of stacked dies, and voltage source location affect the final IR drop and hot spot temperature in the system.",

author = "Jianyong Xie and Daehyun Chung and Madhavan Swaminathan and Michael Mcallister and Alina Deutsch and Lijun Jiang and Rubin, {Barry J.}",

year = "2009",

doi = "10.1109/EPEPS.2009.5338465",

language = "English (US)",

isbn = "9781424444472",

series = "2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09",

pages = "113--116",

booktitle = "2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09",

note = "2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09 ; Conference date: 19-10-2009 Through 21-10-2009",

}

Xie, J, Chung, D, Swaminathan, M, Mcallister, M, Deutsch, A, Jiang, L & Rubin, BJ 2009, Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration. in 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09., 5338465, 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09, pp. 113-116, 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09, Portland, OR, United States, 10/19/09. https://doi.org/10.1109/EPEPS.2009.5338465

Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration. / Xie, Jianyong; Chung, Daehyun; Swaminathan, Madhavan et al.
2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09. 2009. p. 113-116 5338465 (2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration

AU - Xie, Jianyong

AU - Chung, Daehyun

AU - Swaminathan, Madhavan

AU - Mcallister, Michael

AU - Deutsch, Alina

AU - Jiang, Lijun

AU - Rubin, Barry J.

PY - 2009

Y1 - 2009

N2 - In this paper, parameterized electrical-thermal co-analysis for power delivery networks (PDN) in 3D system integration is carried out. A 3D integrated system including glass-ceramic substrate, single and stacked dies, power delivery network, through-silicon vias (TSVs), controlled collapse chip connections (C4s), underfill material, and thermal interface material (TIM) is analyzed with several variable parameters. The analysis results show that temperature effects on DC IR drop can not be neglected. The TIM thermal conductivity, C4 density, stacking order of stacked dies, and voltage source location affect the final IR drop and hot spot temperature in the system.

AB - In this paper, parameterized electrical-thermal co-analysis for power delivery networks (PDN) in 3D system integration is carried out. A 3D integrated system including glass-ceramic substrate, single and stacked dies, power delivery network, through-silicon vias (TSVs), controlled collapse chip connections (C4s), underfill material, and thermal interface material (TIM) is analyzed with several variable parameters. The analysis results show that temperature effects on DC IR drop can not be neglected. The TIM thermal conductivity, C4 density, stacking order of stacked dies, and voltage source location affect the final IR drop and hot spot temperature in the system.

UR - http://www.scopus.com/inward/record.url?scp=74549131048&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=74549131048&partnerID=8YFLogxK

U2 - 10.1109/EPEPS.2009.5338465

DO - 10.1109/EPEPS.2009.5338465

M3 - Conference contribution

AN - SCOPUS:74549131048

SN - 9781424444472

T3 - 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09

SP - 113

EP - 116

BT - 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09

T2 - 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09

Y2 - 19 October 2009 through 21 October 2009

ER -

Xie J, Chung D, Swaminathan M, Mcallister M, Deutsch A, Jiang L et al. Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration. In 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09. 2009. p. 113-116. 5338465. (2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09). doi: 10.1109/EPEPS.2009.5338465

Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration

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