Effect of Vapor Phase Infiltration on Metal-Polymer Adhesion for Ultra-Low-k Dielectric Materials

Pragna Bhaskar, Ethan Shackelford, Emily K. McGuinness, Mohan Kathaperumal, Mark D. Losego, Madhavan Swaminathan

Research output: Contribution to journalArticlepeer-review

Abstract

This paper explores the effect of vapor phase infiltration (VPI) on ultra-low-k (ULK) dielectric materials. Adhesion of metals to these ultra-low-k polymers is an important factor in the fabrication of multilayer redistribution layer (RDL) structures and also the reliability of RDLs. ULK polymers have lower adhesion to metal films than the current industry standard, Ajinomoto Buildup Film (ABF). Earlier studies have shown an improvement in adhesion strength between metal films and benzocyclobutene-based polymers when a VPI treatment is used. In this study we evaluate the effect of VPI on other ULK polymers, having dielectric constants less than 2.5.

Original languageEnglish (US)
Pages (from-to)564-570
Number of pages7
JournalIEEE Transactions on Device and Materials Reliability
Volume23
Issue number4
DOIs
StatePublished - Dec 1 2023

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Safety, Risk, Reliability and Quality
  • Electrical and Electronic Engineering

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