Effect of Vapor Phase Infiltration on Metal-Polymer Adhesion for Ultra-Low-k Dielectric Materials

Pragna Bhaskar; Ethan Shackelford; Emily K. McGuinness; Mohan Kathaperumal; Mark D. Losego; Madhavan Swaminathan

doi:10.1109/TDMR.2023.3320976

Effect of Vapor Phase Infiltration on Metal-Polymer Adhesion for Ultra-Low-k Dielectric Materials

Pragna Bhaskar
, Ethan Shackelford
, Emily K. McGuinness
, Mohan Kathaperumal
, Mark D. Losego
, Madhavan Swaminathan

Electrical Engineering

Research output: Contribution to journal › Article › peer-review

1 Scopus citations

Abstract

This paper explores the effect of vapor phase infiltration (VPI) on ultra-low-k (ULK) dielectric materials. Adhesion of metals to these ultra-low-k polymers is an important factor in the fabrication of multilayer redistribution layer (RDL) structures and also the reliability of RDLs. ULK polymers have lower adhesion to metal films than the current industry standard, Ajinomoto Buildup Film (ABF). Earlier studies have shown an improvement in adhesion strength between metal films and benzocyclobutene-based polymers when a VPI treatment is used. In this study we evaluate the effect of VPI on other ULK polymers, having dielectric constants less than 2.5.

Original language	English (US)
Pages (from-to)	564-570
Number of pages	7
Journal	IEEE Transactions on Device and Materials Reliability
Volume	23
Issue number	4
DOIs	https://doi.org/10.1109/TDMR.2023.3320976
State	Published - Dec 1 2023

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Safety, Risk, Reliability and Quality
Electrical and Electronic Engineering

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10.1109/TDMR.2023.3320976

Cite this

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title = "Effect of Vapor Phase Infiltration on Metal-Polymer Adhesion for Ultra-Low-k Dielectric Materials",

abstract = "This paper explores the effect of vapor phase infiltration (VPI) on ultra-low-k (ULK) dielectric materials. Adhesion of metals to these ultra-low-k polymers is an important factor in the fabrication of multilayer redistribution layer (RDL) structures and also the reliability of RDLs. ULK polymers have lower adhesion to metal films than the current industry standard, Ajinomoto Buildup Film (ABF). Earlier studies have shown an improvement in adhesion strength between metal films and benzocyclobutene-based polymers when a VPI treatment is used. In this study we evaluate the effect of VPI on other ULK polymers, having dielectric constants less than 2.5.",

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AU - McGuinness, Emily K.

AU - Kathaperumal, Mohan

AU - Losego, Mark D.

AU - Swaminathan, Madhavan

PY - 2023/12/1

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AB - This paper explores the effect of vapor phase infiltration (VPI) on ultra-low-k (ULK) dielectric materials. Adhesion of metals to these ultra-low-k polymers is an important factor in the fabrication of multilayer redistribution layer (RDL) structures and also the reliability of RDLs. ULK polymers have lower adhesion to metal films than the current industry standard, Ajinomoto Buildup Film (ABF). Earlier studies have shown an improvement in adhesion strength between metal films and benzocyclobutene-based polymers when a VPI treatment is used. In this study we evaluate the effect of VPI on other ULK polymers, having dielectric constants less than 2.5.

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Effect of Vapor Phase Infiltration on Metal-Polymer Adhesion for Ultra-Low-k Dielectric Materials

Abstract

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