Effect of via-transitions on signal integrity using power transmission lines

David C. Zhang, Madhavan Swaminathan, David Keezer

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Abstract

Transmission lines carrying high-speed I/O signals that traverse through different metal layers in a printed circuit board suffer from return path discontinuities. As a result, significant amount of electromagnetic energy can couple to surrounding circuits and the power distribution network. In this work, we designed three printed circuit board (PCB) test vehicles using different power distribution topologies. One of them was based on a recently proposed power delivery method using power transmission lines (PTL). The other two were designed according to conventional power-ground plane pair approach. We show through measurement that PTL-based design provides less than -40dB of crosstalk between a signal line with multiple via-transitions and a nearby victim line. Measured data also showed that the PTL-based test vehicle had more than 68% of power supply noise reduction as compared to conventional designs.

Original languageEnglish (US)
Title of host publication2016 IEEE 20th Workshop on Signal and Power Integrity, SPI 2016 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781509003495
DOIs
StatePublished - Jun 20 2016
Event20th IEEE Workshop on Signal and Power Integrity, SPI 2016 - Turin, Italy
Duration: May 8 2016May 11 2016

Publication series

Name2016 IEEE 20th Workshop on Signal and Power Integrity, SPI 2016 - Proceedings

Conference

Conference20th IEEE Workshop on Signal and Power Integrity, SPI 2016
Country/TerritoryItaly
CityTurin
Period5/8/165/11/16

All Science Journal Classification (ASJC) codes

  • Signal Processing
  • Electrical and Electronic Engineering
  • Computer Networks and Communications
  • Hardware and Architecture

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