TY - GEN
T1 - Effect of via-transitions on signal integrity using power transmission lines
AU - Zhang, David C.
AU - Swaminathan, Madhavan
AU - Keezer, David
N1 - Publisher Copyright:
© 2016 IEEE.
PY - 2016/6/20
Y1 - 2016/6/20
N2 - Transmission lines carrying high-speed I/O signals that traverse through different metal layers in a printed circuit board suffer from return path discontinuities. As a result, significant amount of electromagnetic energy can couple to surrounding circuits and the power distribution network. In this work, we designed three printed circuit board (PCB) test vehicles using different power distribution topologies. One of them was based on a recently proposed power delivery method using power transmission lines (PTL). The other two were designed according to conventional power-ground plane pair approach. We show through measurement that PTL-based design provides less than -40dB of crosstalk between a signal line with multiple via-transitions and a nearby victim line. Measured data also showed that the PTL-based test vehicle had more than 68% of power supply noise reduction as compared to conventional designs.
AB - Transmission lines carrying high-speed I/O signals that traverse through different metal layers in a printed circuit board suffer from return path discontinuities. As a result, significant amount of electromagnetic energy can couple to surrounding circuits and the power distribution network. In this work, we designed three printed circuit board (PCB) test vehicles using different power distribution topologies. One of them was based on a recently proposed power delivery method using power transmission lines (PTL). The other two were designed according to conventional power-ground plane pair approach. We show through measurement that PTL-based design provides less than -40dB of crosstalk between a signal line with multiple via-transitions and a nearby victim line. Measured data also showed that the PTL-based test vehicle had more than 68% of power supply noise reduction as compared to conventional designs.
UR - http://www.scopus.com/inward/record.url?scp=84980368710&partnerID=8YFLogxK
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U2 - 10.1109/SaPIW.2016.7496293
DO - 10.1109/SaPIW.2016.7496293
M3 - Conference contribution
AN - SCOPUS:84980368710
T3 - 2016 IEEE 20th Workshop on Signal and Power Integrity, SPI 2016 - Proceedings
BT - 2016 IEEE 20th Workshop on Signal and Power Integrity, SPI 2016 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 20th IEEE Workshop on Signal and Power Integrity, SPI 2016
Y2 - 8 May 2016 through 11 May 2016
ER -