Effect of wafer level packaging, silicon substrate and board material on gigabit board-silicon-board data transmission
- W. Kim
- , R. Madhavan
- , J. Mao
- , J. Choi
- , S. Choi
- , D. Ravi
- , V. Sundaram
- , S. Sankararaman
- , P. Gupta
- , Z. Zhang
- , G. Lo
- , M. Swaminathan
- , R. Tummala
- , S. Sitaraman
- , C. P. Wong
- , M. Iyer
- , M. Rotaru
- , A. Tay
Research output: Contribution to journal › Conference article › peer-review
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