Effect of wafer level packaging, silicon substrate and board material on gigabit board-silicon-board data transmission

W. Kim, R. Madhavan, J. Mao, J. Choi, S. Choi, D. Ravi, V. Sundaram, S. Sankararaman, P. Gupta, Z. Zhang, G. Lo, M. Swaminathan, R. Tummala, S. Sitaraman, C. P. Wong, M. Iyer, M. Rotaru, A. Tay

Research output: Contribution to journal › Conference article › peer-review

5 Scopus citations

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Engineering