TY - GEN
T1 - Effects of drive air pressure, exhaust pipe length and deposition height on the morphology of Sn99.3Cu0.7 solder ball
AU - Liao, Daokun
AU - Su, Dan
AU - Liu, Sheng
AU - Li, Xiaotian
AU - Zhang, Honghai
N1 - Publisher Copyright:
© 2016 IEEE.
PY - 2016/10/4
Y1 - 2016/10/4
N2 - As a uniform solder balls manufacturing technology, metal droplets jetting technology can realize controllable deposition of droplets, so it can apply to the production of solder balls array in BGA and CSP packaging. To study the influence parameters to the morphology of the solder balls, we developed an equipment based on the Pneumatic diaphragm drop-on-demand Technology. In this paper, we changed the air pressure and exhaust pipe length to analysis how they influenced the size and uniformity of the solder balls. Furthermore, we changed the deposition height to study how they influenced the morphology of the deposited solder balls. The results indicated that the size of the solder ball increased when the air pressure and exhaust pipe length elevated and the solder balls were uniform under different air pressure and exhaust pipe length. In addition, the surface of the deposited solder balls were smooth relatively, with no splash, no matter what the deposition height were.
AB - As a uniform solder balls manufacturing technology, metal droplets jetting technology can realize controllable deposition of droplets, so it can apply to the production of solder balls array in BGA and CSP packaging. To study the influence parameters to the morphology of the solder balls, we developed an equipment based on the Pneumatic diaphragm drop-on-demand Technology. In this paper, we changed the air pressure and exhaust pipe length to analysis how they influenced the size and uniformity of the solder balls. Furthermore, we changed the deposition height to study how they influenced the morphology of the deposited solder balls. The results indicated that the size of the solder ball increased when the air pressure and exhaust pipe length elevated and the solder balls were uniform under different air pressure and exhaust pipe length. In addition, the surface of the deposited solder balls were smooth relatively, with no splash, no matter what the deposition height were.
UR - http://www.scopus.com/inward/record.url?scp=84994172715&partnerID=8YFLogxK
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U2 - 10.1109/ICEPT.2016.7583409
DO - 10.1109/ICEPT.2016.7583409
M3 - Conference contribution
AN - SCOPUS:84994172715
T3 - 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016
SP - 1508
EP - 1511
BT - 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016
A2 - Bi, Keyun
A2 - Liu, Sheng
A2 - Zhou, Shengjun
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 17th International Conference on Electronic Packaging Technology, ICEPT 2016
Y2 - 16 August 2016 through 19 August 2016
ER -