TY - GEN
T1 - Effects of sintering conditions on the diffusion bonding of AGC-Cu electrical contacts
AU - Waryoba, Daudi R.
AU - Paradis, Linsea
AU - Jones, Arthur E.
AU - Bigley, Adrew
N1 - Publisher Copyright:
© 2019 Metal Powder Industries Federation.
PY - 2020
Y1 - 2020
N2 - The conventional press and sinter method for fabrication of bi-layered silver graphite-copper electrical contacts has shown to be challenging process due to the immiscibility of graphite in copper and silver. During sintering of silver graphite-copper compacts, silver diffuses into copper leaving a trace of graphite at the interface. This creates a poor interface between the mating surfaces, thereby decreasing the shear strength of the joint. In this work, interlayers with different compositions were used to promote diffusion bonding at various sintering conditions. Microhardness, electrical resistivity, electron backscatter diffraction (EBSD), and shear testing, are some of the techniques used to characterize the microstructure of diffusion bonded parts.
AB - The conventional press and sinter method for fabrication of bi-layered silver graphite-copper electrical contacts has shown to be challenging process due to the immiscibility of graphite in copper and silver. During sintering of silver graphite-copper compacts, silver diffuses into copper leaving a trace of graphite at the interface. This creates a poor interface between the mating surfaces, thereby decreasing the shear strength of the joint. In this work, interlayers with different compositions were used to promote diffusion bonding at various sintering conditions. Microhardness, electrical resistivity, electron backscatter diffraction (EBSD), and shear testing, are some of the techniques used to characterize the microstructure of diffusion bonded parts.
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M3 - Conference contribution
AN - SCOPUS:85081096488
T3 - Advances in Powder Metallurgy and Particulate Materials - 2019: Proceedings of the 2019 International Conference on Powder Metallurgy and Particulate Materials
SP - 305
EP - 315
BT - Advances in Powder Metallurgy and Particulate Materials - 2019
PB - Metal Powder Industries Federation
T2 - 2019 International Conference on Powder Metallurgy and Particulate Materials, POWDERMET 2019
Y2 - 23 June 2019 through 26 June 2019
ER -