TY - GEN
T1 - Effects of temperature and relative humidity in transmission systems using differential signaling
AU - Morales, Aldo
AU - Agili, Sedig
AU - Resso, Mike
AU - Clark, Jeff
AU - Kocuba, Chris
PY - 2013
Y1 - 2013
N2 - Most of the current on-board and cable communication systems are based on differential signaling. If any asymmetry happens in the differential lines then unwanted RF radiation will occur. On the other hand, placement of the communication equipment that contains differential signaling can be located anywhere in the world with different environmental conditions. To this effect, researchers have explored the effect of the humidity and temperature on PCB boards but mostly in single mode communication systems. In fact, environmental issues are very important to the signal integrity (SI) community since they have a profound effect in the performance of communications systems. In this paper, we explore relative humidity and temperature effects on PCB boards with differential signaling. Of particular interest is mode conversion, since this increases unwanted RF radiation.
AB - Most of the current on-board and cable communication systems are based on differential signaling. If any asymmetry happens in the differential lines then unwanted RF radiation will occur. On the other hand, placement of the communication equipment that contains differential signaling can be located anywhere in the world with different environmental conditions. To this effect, researchers have explored the effect of the humidity and temperature on PCB boards but mostly in single mode communication systems. In fact, environmental issues are very important to the signal integrity (SI) community since they have a profound effect in the performance of communications systems. In this paper, we explore relative humidity and temperature effects on PCB boards with differential signaling. Of particular interest is mode conversion, since this increases unwanted RF radiation.
UR - http://www.scopus.com/inward/record.url?scp=84883716038&partnerID=8YFLogxK
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M3 - Conference contribution
AN - SCOPUS:84883716038
SN - 9781627484725
T3 - DesignCon 2013: Where Chipheads Connect
SP - 520
EP - 536
BT - DesignCon 2013
T2 - DesignCon 2013: Where Chipheads Connect
Y2 - 28 January 2013 through 31 January 2013
ER -