Efficient computation of capacitive coupling between planar and cylindrical interconnections

Ki Jin Han; Madhavan Swaminathan

doi:10.1109/EDAPS.2014.7030803

Efficient computation of capacitive coupling between planar and cylindrical interconnections

Ki Jin Han, Madhavan Swaminathan

Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Scopus citations

Abstract

For the efficiency improvement of 3D path-finding methodology, this paper presents the reduction of computational cost in the calculation of capacitive coupling between planar and cylindrical structures. The previously used global adaptive quadrature for integrations involving the angular variable is replaced by a simple trapezoidal quadrature with the double-exponential transformation. Also, the other integrations over planar variables is approximated to a simple summation. From the verifications of the proposed technique for various coupling structures shows that the updated modeling method reduces the computation time by up to 12%.

Original language	English (US)
Title of host publication	2014 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2014
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	13-16
Number of pages	4
ISBN (Electronic)	9781479962570
DOIs	https://doi.org/10.1109/EDAPS.2014.7030803
State	Published - 2014
Event	2014 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2014 - Bangalore, India Duration: Dec 14 2014 → Dec 16 2014

Publication series

Name	2014 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2014

Conference

Conference	2014 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2014
Country/Territory	India
City	Bangalore
Period	12/14/14 → 12/16/14

All Science Journal Classification (ASJC) codes

Automotive Engineering
General Computer Science
Control and Systems Engineering
Electrical and Electronic Engineering

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10.1109/EDAPS.2014.7030803

Cite this

Han, K. J., & Swaminathan, M. (2014). Efficient computation of capacitive coupling between planar and cylindrical interconnections. In 2014 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2014 (pp. 13-16). Article 7030803 (2014 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2014). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EDAPS.2014.7030803

Han, Ki Jin ; Swaminathan, Madhavan. / Efficient computation of capacitive coupling between planar and cylindrical interconnections. 2014 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2014. Institute of Electrical and Electronics Engineers Inc., 2014. pp. 13-16 (2014 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2014).

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abstract = "For the efficiency improvement of 3D path-finding methodology, this paper presents the reduction of computational cost in the calculation of capacitive coupling between planar and cylindrical structures. The previously used global adaptive quadrature for integrations involving the angular variable is replaced by a simple trapezoidal quadrature with the double-exponential transformation. Also, the other integrations over planar variables is approximated to a simple summation. From the verifications of the proposed technique for various coupling structures shows that the updated modeling method reduces the computation time by up to 12%.",

author = "Han, {Ki Jin} and Madhavan Swaminathan",

note = "Publisher Copyright: {\textcopyright} 2014 IEEE.; 2014 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2014 ; Conference date: 14-12-2014 Through 16-12-2014",

year = "2014",

doi = "10.1109/EDAPS.2014.7030803",

language = "English (US)",

series = "2014 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2014",

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Han, KJ & Swaminathan, M 2014, Efficient computation of capacitive coupling between planar and cylindrical interconnections. in 2014 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2014., 7030803, 2014 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2014, Institute of Electrical and Electronics Engineers Inc., pp. 13-16, 2014 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2014, Bangalore, India, 12/14/14. https://doi.org/10.1109/EDAPS.2014.7030803

Efficient computation of capacitive coupling between planar and cylindrical interconnections. / Han, Ki Jin; Swaminathan, Madhavan.
2014 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2014. Institute of Electrical and Electronics Engineers Inc., 2014. p. 13-16 7030803 (2014 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2014).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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AB - For the efficiency improvement of 3D path-finding methodology, this paper presents the reduction of computational cost in the calculation of capacitive coupling between planar and cylindrical structures. The previously used global adaptive quadrature for integrations involving the angular variable is replaced by a simple trapezoidal quadrature with the double-exponential transformation. Also, the other integrations over planar variables is approximated to a simple summation. From the verifications of the proposed technique for various coupling structures shows that the updated modeling method reduces the computation time by up to 12%.

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Han KJ, Swaminathan M. Efficient computation of capacitive coupling between planar and cylindrical interconnections. In 2014 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2014. Institute of Electrical and Electronics Engineers Inc. 2014. p. 13-16. 7030803. (2014 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2014). doi: 10.1109/EDAPS.2014.7030803

Efficient computation of capacitive coupling between planar and cylindrical interconnections

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