Efficient simulation of power/ground planes for SiP applications

Krishna Bharath, Ege Engin, Madhavan Swaminathan, Kazuhide Uriu, Toru Yamada

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Scopus citations


Packages for modern mixed signal systems in package (SiP) require split planes and power islands to isolate multiple power supplies. To reduce design iterations due to signal integrity issues, the frequency response of the package needs to be obtained accurately at an early stage of the design. Fullwave EM solvers are generally the most accurate tools available. However, the high time and memory required by such tools relegates their use to final verification, at which stage design iterations are expensive. The finite difference method has been shown to be efficient in simulating single plane-pair structures with slots as long as one plane is completely solid. Also, the multilayer finite difference method (M-FDM) can accurately model multilayer structures with apertures, so long as there are no power islands. In this paper, a formulation for efficient simulation of multilayer structures with split planes has been investigated. Further, a method by which transmission lines can be integrated with a power distribution network containing apertures and split planes has been discussed. The formulation has been validated by comparing results with full-wave EM simulations.

Original languageEnglish (US)
Title of host publicationProceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07
Number of pages7
StatePublished - 2007
Event57th Electronic Components and Technology Conference 2007, ECTC '07 - Sparks, NV, United States
Duration: May 29 2007Jun 1 2007

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503


Conference57th Electronic Components and Technology Conference 2007, ECTC '07
Country/TerritoryUnited States
CitySparks, NV

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering


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