TY - GEN
T1 - Electric field integral equation combined with cylindrical conduction mode basis functions for electrical modeling of three-dimensional interconnects
AU - Han, Ki Jin
AU - Swaminathan, Madhavan
AU - Engin, Ege
PY - 2008
Y1 - 2008
N2 - For the modeling of interconnect in three-dimensional packagings, this paper proposes a method based on the electric field integral equation (EFIE) with cylindrical conduction mode basis functions (CMBF). The bases are defined to describe arbitrary skin and proximity effects, and partial impedances are obtained from the formulation of the EFIE with CMBF's. Examples of several 3-D interconnects verify that the proposed method is efficient in speed and memory.
AB - For the modeling of interconnect in three-dimensional packagings, this paper proposes a method based on the electric field integral equation (EFIE) with cylindrical conduction mode basis functions (CMBF). The bases are defined to describe arbitrary skin and proximity effects, and partial impedances are obtained from the formulation of the EFIE with CMBF's. Examples of several 3-D interconnects verify that the proposed method is efficient in speed and memory.
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U2 - 10.1109/DAC.2008.4555854
DO - 10.1109/DAC.2008.4555854
M3 - Conference contribution
AN - SCOPUS:51549121395
SN - 9781605581156
T3 - Proceedings - Design Automation Conference
SP - 421
EP - 424
BT - Proceedings of the 45th Design Automation Conference, DAC
T2 - 45th Design Automation Conference, DAC
Y2 - 8 June 2008 through 13 June 2008
ER -