Electrical and thermal layout design and optimization considerations for DPS active IPEM

Ying Feng Pang; Jonah Zhou Chen; Elaine P. Scott; Karen A. Thole

doi:10.1115/IMECE2002-33778

Electrical and thermal layout design and optimization considerations for DPS active IPEM

Ying Feng Pang, Jonah Zhou Chen, Elaine P. Scott, Karen A. Thole

Mechanical Engineering

Research output: Contribution to journal › Conference article › peer-review

Abstract

A methodology was developed to optimize the 3D geometrical design layout of an active integrated power electronics module (IPEM) by considering both electrical and thermal performance. This paper is focused on the thermal analysis, which was performed using 3D finite element and computational fluid dynamic (CFD) analyses. A parametric study was conducted to determine the thermal performance of several different design layouts. A sensitivity analysis was performed to determine the overall uncertainty of the predicted simulations. The final design, Gen-II.C, provided a 70% reduction in the common mode current, a 4% reduction in the size of the geometric footprint, and a 3°C reduction in the maximum temperature over Gen-II.A, thus providing an increase in the overall performance.

Original language	English (US)
Pages (from-to)	253-259
Number of pages	7
Journal	American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD
Volume	372
Issue number	7
DOIs	https://doi.org/10.1115/IMECE2002-33778
State	Published - 2002
Event	2002 ASME International Mechanical Engineering Congress and Exposition - New Orleans, LA, United States Duration: Nov 17 2002 → Nov 22 2002

All Science Journal Classification (ASJC) codes

Mechanical Engineering
Fluid Flow and Transfer Processes

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10.1115/IMECE2002-33778

Cite this

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title = "Electrical and thermal layout design and optimization considerations for DPS active IPEM",

abstract = "A methodology was developed to optimize the 3D geometrical design layout of an active integrated power electronics module (IPEM) by considering both electrical and thermal performance. This paper is focused on the thermal analysis, which was performed using 3D finite element and computational fluid dynamic (CFD) analyses. A parametric study was conducted to determine the thermal performance of several different design layouts. A sensitivity analysis was performed to determine the overall uncertainty of the predicted simulations. The final design, Gen-II.C, provided a 70% reduction in the common mode current, a 4% reduction in the size of the geometric footprint, and a 3°C reduction in the maximum temperature over Gen-II.A, thus providing an increase in the overall performance.",

author = "Pang, {Ying Feng} and Chen, {Jonah Zhou} and Scott, {Elaine P.} and Thole, {Karen A.}",

year = "2002",

doi = "10.1115/IMECE2002-33778",

language = "English (US)",

volume = "372",

pages = "253--259",

journal = "American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD",

issn = "0272-5673",

publisher = "American Society of Mechanical Engineers (ASME)",

number = "7",

note = "2002 ASME International Mechanical Engineering Congress and Exposition ; Conference date: 17-11-2002 Through 22-11-2002",

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TY - JOUR

T1 - Electrical and thermal layout design and optimization considerations for DPS active IPEM

AU - Pang, Ying Feng

AU - Chen, Jonah Zhou

AU - Scott, Elaine P.

AU - Thole, Karen A.

PY - 2002

Y1 - 2002

N2 - A methodology was developed to optimize the 3D geometrical design layout of an active integrated power electronics module (IPEM) by considering both electrical and thermal performance. This paper is focused on the thermal analysis, which was performed using 3D finite element and computational fluid dynamic (CFD) analyses. A parametric study was conducted to determine the thermal performance of several different design layouts. A sensitivity analysis was performed to determine the overall uncertainty of the predicted simulations. The final design, Gen-II.C, provided a 70% reduction in the common mode current, a 4% reduction in the size of the geometric footprint, and a 3°C reduction in the maximum temperature over Gen-II.A, thus providing an increase in the overall performance.

AB - A methodology was developed to optimize the 3D geometrical design layout of an active integrated power electronics module (IPEM) by considering both electrical and thermal performance. This paper is focused on the thermal analysis, which was performed using 3D finite element and computational fluid dynamic (CFD) analyses. A parametric study was conducted to determine the thermal performance of several different design layouts. A sensitivity analysis was performed to determine the overall uncertainty of the predicted simulations. The final design, Gen-II.C, provided a 70% reduction in the common mode current, a 4% reduction in the size of the geometric footprint, and a 3°C reduction in the maximum temperature over Gen-II.A, thus providing an increase in the overall performance.

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DO - 10.1115/IMECE2002-33778

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EP - 259

JO - American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD

JF - American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD

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T2 - 2002 ASME International Mechanical Engineering Congress and Exposition

Y2 - 17 November 2002 through 22 November 2002

ER -

Electrical and thermal layout design and optimization considerations for DPS active IPEM

Abstract

All Science Journal Classification (ASJC) codes

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