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Electrical design and modeling challenges for 3D system integration
Madhavan Swaminathan
Electrical Engineering
Research output
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Chapter in Book/Report/Conference proceeding
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Conference contribution
19
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Scopus citations
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Keyphrases
Semiconductor Industry
100%
Design Challenges
100%
3D Integration
100%
Electrical Modeling
100%
Electrical Design
100%
Modelling Challenges
100%
3D System Integration
100%
Interposer
100%
Electronics Industry
66%
Package-on-package
66%
System-in-package
66%
Technologist
33%
Transistor
33%
Technology Development
33%
Miniaturization
33%
Low Power
33%
Low-cost Substrates
33%
Performance Improvement
33%
Reduced Delay
33%
Scale Problem
33%
Performance Advantage
33%
Electronic System
33%
Low-cost System
33%
Overall System
33%
Electrical Performance
33%
3D Technology
33%
3D IC
33%
Thermal Management
33%
Bond Wire
33%
Semiconductor Properties
33%
Through Silicon via
33%
External World
33%
System Miniaturization
33%
Glass Interposer
33%
Package Substrate
33%
More-than-Moore
33%
Package Technology
33%
Ultra-miniaturization
33%
Engineering
Integrated Information System
100%
Interposer
100%
Electronics Industry
66%
Technologist
33%
Integrated System
33%
System-in-Package
33%
Electrical Performance
33%
Bandwidth Performance
33%
Semiconductor Property
33%
Glass Interposer
33%
System-on-Package
33%