Electrical modeling of wirebonds in stacked ICs using cylindrical conduction mode basis functions

Ki Jin Han; Madhavan Swaminathan; Ege Engin

doi:10.1109/ECTC.2008.4550131

Electrical modeling of wirebonds in stacked ICs using cylindrical conduction mode basis functions

Ki Jin Han, Madhavan Swaminathan, Ege Engin

Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

This paper discusses an efficient method for simulation and modeling of three-dimensional (3-D) interconnections such as wire bonds and through-hole vias. The proposed method is based on the volume electric field integral equation (EFIE), and approximates current density distribution with cylindrical conduction mode basis functions (CMBF). The geometrical fitness and orthogonal property of the basis functions are found useful in capturing skin effect and current crowding in cylindrical conductors. The Analyses of wire bonds using the proposed method demonstrate various 3-D coupling issues including wire bending effect, vertical coupling, and ground wiring.

Original language	English (US)
Title of host publication	2008 Proceedings 58th Electronic Components and Technology Conference, ECTC
Pages	1225-1230
Number of pages	6
DOIs	https://doi.org/10.1109/ECTC.2008.4550131
State	Published - 2008
Event	2008 58th Electronic Components and Technology Conference, ECTC - Lake Buena Vista, FL, United States Duration: May 27 2008 → May 30 2008

Publication series

Name	Proceedings - Electronic Components and Technology Conference
ISSN (Print)	0569-5503

Conference

Conference	2008 58th Electronic Components and Technology Conference, ECTC
Country/Territory	United States
City	Lake Buena Vista, FL
Period	5/27/08 → 5/30/08

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

10.1109/ECTC.2008.4550131

Cite this

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title = "Electrical modeling of wirebonds in stacked ICs using cylindrical conduction mode basis functions",

abstract = "This paper discusses an efficient method for simulation and modeling of three-dimensional (3-D) interconnections such as wire bonds and through-hole vias. The proposed method is based on the volume electric field integral equation (EFIE), and approximates current density distribution with cylindrical conduction mode basis functions (CMBF). The geometrical fitness and orthogonal property of the basis functions are found useful in capturing skin effect and current crowding in cylindrical conductors. The Analyses of wire bonds using the proposed method demonstrate various 3-D coupling issues including wire bending effect, vertical coupling, and ground wiring.",

author = "Han, {Ki Jin} and Madhavan Swaminathan and Ege Engin",

year = "2008",

doi = "10.1109/ECTC.2008.4550131",

language = "English (US)",

isbn = "9781424422302",

series = "Proceedings - Electronic Components and Technology Conference",

pages = "1225--1230",

booktitle = "2008 Proceedings 58th Electronic Components and Technology Conference, ECTC",

note = "2008 58th Electronic Components and Technology Conference, ECTC ; Conference date: 27-05-2008 Through 30-05-2008",

}

Han, KJ, Swaminathan, M & Engin, E 2008, Electrical modeling of wirebonds in stacked ICs using cylindrical conduction mode basis functions. in 2008 Proceedings 58th Electronic Components and Technology Conference, ECTC., 4550131, Proceedings - Electronic Components and Technology Conference, pp. 1225-1230, 2008 58th Electronic Components and Technology Conference, ECTC, Lake Buena Vista, FL, United States, 5/27/08. https://doi.org/10.1109/ECTC.2008.4550131

Electrical modeling of wirebonds in stacked ICs using cylindrical conduction mode basis functions. / Han, Ki Jin; Swaminathan, Madhavan; Engin, Ege.
2008 Proceedings 58th Electronic Components and Technology Conference, ECTC. 2008. p. 1225-1230 4550131 (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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AU - Han, Ki Jin

AU - Swaminathan, Madhavan

AU - Engin, Ege

PY - 2008

Y1 - 2008

N2 - This paper discusses an efficient method for simulation and modeling of three-dimensional (3-D) interconnections such as wire bonds and through-hole vias. The proposed method is based on the volume electric field integral equation (EFIE), and approximates current density distribution with cylindrical conduction mode basis functions (CMBF). The geometrical fitness and orthogonal property of the basis functions are found useful in capturing skin effect and current crowding in cylindrical conductors. The Analyses of wire bonds using the proposed method demonstrate various 3-D coupling issues including wire bending effect, vertical coupling, and ground wiring.

AB - This paper discusses an efficient method for simulation and modeling of three-dimensional (3-D) interconnections such as wire bonds and through-hole vias. The proposed method is based on the volume electric field integral equation (EFIE), and approximates current density distribution with cylindrical conduction mode basis functions (CMBF). The geometrical fitness and orthogonal property of the basis functions are found useful in capturing skin effect and current crowding in cylindrical conductors. The Analyses of wire bonds using the proposed method demonstrate various 3-D coupling issues including wire bending effect, vertical coupling, and ground wiring.

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BT - 2008 Proceedings 58th Electronic Components and Technology Conference, ECTC

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Y2 - 27 May 2008 through 30 May 2008

ER -

Electrical modeling of wirebonds in stacked ICs using cylindrical conduction mode basis functions

Abstract

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Conference

All Science Journal Classification (ASJC) codes

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