Electrical-thermal co-analysis for power delivery networks in 3D system integration

Jianyong Xie; Daehyun Chung; Madhavan Swaminathan; Michael Mcallister; Alina Deutsch; Lijun Jiang; Barry J. Rubin

doi:10.1109/3DIC.2009.5306525

Electrical-thermal co-analysis for power delivery networks in 3D system integration

Jianyong Xie, Daehyun Chung, Madhavan Swaminathan, Michael Mcallister, Alina Deutsch, Lijun Jiang, Barry J. Rubin

Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

24 Scopus citations

Abstract

In this paper, an electrical-thermal co-analysis method for power delivery networks in 3D system integration is proposed. For electrical analysis, temperature-dependent electrical resistivity of conductors is taken into account. For thermal analysis, Joule heating effect due to the current flowing through conductors is considered. The proposed co-analysis method is carried out using Rgen and ChipJoule of IBM EIP Tool Suite. An example of 3D integration system including stacked chips, power delivery network, glass-ceramic substrate, through-silicon vias, controlled collapse chip connections (C4s), underfill material, and TIM is analyzed using the proposed method. The simulation results show that the temperature effect on IR drop can not be neglected. The error of not considering thermal effect on IR drop is about 20% in the example.

Original language	English (US)
Title of host publication	2009 IEEE International Conference on 3D System Integration, 3DIC 2009
DOIs	https://doi.org/10.1109/3DIC.2009.5306525
State	Published - 2009
Event	2009 IEEE International Conference on 3D System Integration, 3DIC 2009 - San Francisco, CA, United States Duration: Sep 28 2009 → Sep 30 2009

Publication series

Name	2009 IEEE International Conference on 3D System Integration, 3DIC 2009

Other

Other	2009 IEEE International Conference on 3D System Integration, 3DIC 2009
Country/Territory	United States
City	San Francisco, CA
Period	9/28/09 → 9/30/09

All Science Journal Classification (ASJC) codes

Hardware and Architecture
Electrical and Electronic Engineering

Access to Document

10.1109/3DIC.2009.5306525

Cite this

Xie, J., Chung, D., Swaminathan, M., Mcallister, M., Deutsch, A., Jiang, L., & Rubin, B. J. (2009). Electrical-thermal co-analysis for power delivery networks in 3D system integration. In 2009 IEEE International Conference on 3D System Integration, 3DIC 2009 Article 5306525 (2009 IEEE International Conference on 3D System Integration, 3DIC 2009). https://doi.org/10.1109/3DIC.2009.5306525

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title = "Electrical-thermal co-analysis for power delivery networks in 3D system integration",

abstract = "In this paper, an electrical-thermal co-analysis method for power delivery networks in 3D system integration is proposed. For electrical analysis, temperature-dependent electrical resistivity of conductors is taken into account. For thermal analysis, Joule heating effect due to the current flowing through conductors is considered. The proposed co-analysis method is carried out using Rgen and ChipJoule of IBM EIP Tool Suite. An example of 3D integration system including stacked chips, power delivery network, glass-ceramic substrate, through-silicon vias, controlled collapse chip connections (C4s), underfill material, and TIM is analyzed using the proposed method. The simulation results show that the temperature effect on IR drop can not be neglected. The error of not considering thermal effect on IR drop is about 20% in the example.",

author = "Jianyong Xie and Daehyun Chung and Madhavan Swaminathan and Michael Mcallister and Alina Deutsch and Lijun Jiang and Rubin, {Barry J.}",

year = "2009",

doi = "10.1109/3DIC.2009.5306525",

language = "English (US)",

isbn = "9781424445127",

series = "2009 IEEE International Conference on 3D System Integration, 3DIC 2009",

booktitle = "2009 IEEE International Conference on 3D System Integration, 3DIC 2009",

note = "2009 IEEE International Conference on 3D System Integration, 3DIC 2009 ; Conference date: 28-09-2009 Through 30-09-2009",

}

Xie, J, Chung, D, Swaminathan, M, Mcallister, M, Deutsch, A, Jiang, L & Rubin, BJ 2009, Electrical-thermal co-analysis for power delivery networks in 3D system integration. in 2009 IEEE International Conference on 3D System Integration, 3DIC 2009., 5306525, 2009 IEEE International Conference on 3D System Integration, 3DIC 2009, 2009 IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, CA, United States, 9/28/09. https://doi.org/10.1109/3DIC.2009.5306525

Electrical-thermal co-analysis for power delivery networks in 3D system integration. / Xie, Jianyong; Chung, Daehyun; Swaminathan, Madhavan et al.
2009 IEEE International Conference on 3D System Integration, 3DIC 2009. 2009. 5306525 (2009 IEEE International Conference on 3D System Integration, 3DIC 2009).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Electrical-thermal co-analysis for power delivery networks in 3D system integration

AU - Xie, Jianyong

AU - Chung, Daehyun

AU - Swaminathan, Madhavan

AU - Mcallister, Michael

AU - Deutsch, Alina

AU - Jiang, Lijun

AU - Rubin, Barry J.

PY - 2009

Y1 - 2009

N2 - In this paper, an electrical-thermal co-analysis method for power delivery networks in 3D system integration is proposed. For electrical analysis, temperature-dependent electrical resistivity of conductors is taken into account. For thermal analysis, Joule heating effect due to the current flowing through conductors is considered. The proposed co-analysis method is carried out using Rgen and ChipJoule of IBM EIP Tool Suite. An example of 3D integration system including stacked chips, power delivery network, glass-ceramic substrate, through-silicon vias, controlled collapse chip connections (C4s), underfill material, and TIM is analyzed using the proposed method. The simulation results show that the temperature effect on IR drop can not be neglected. The error of not considering thermal effect on IR drop is about 20% in the example.

AB - In this paper, an electrical-thermal co-analysis method for power delivery networks in 3D system integration is proposed. For electrical analysis, temperature-dependent electrical resistivity of conductors is taken into account. For thermal analysis, Joule heating effect due to the current flowing through conductors is considered. The proposed co-analysis method is carried out using Rgen and ChipJoule of IBM EIP Tool Suite. An example of 3D integration system including stacked chips, power delivery network, glass-ceramic substrate, through-silicon vias, controlled collapse chip connections (C4s), underfill material, and TIM is analyzed using the proposed method. The simulation results show that the temperature effect on IR drop can not be neglected. The error of not considering thermal effect on IR drop is about 20% in the example.

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ER -

Electrical-thermal co-analysis for power delivery networks in 3D system integration

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