Electrical-thermal modeling of through-silicon via (TSV) arrays in interposer

Engineering

• Thermal Effect 100%
• Interposer 100%
• Silicon Substrate 50%
• Basis Function 50%
• Thermal Conductivity 50%
• Multigrid 50%
• Initial Guess 50%
• Thermal System 50%
• Insertion Loss 50%
• Critical Region 50%
• Crosstalk 50%
• Electrical Conductivity 50%
• Temperature Estimation 50%

Keyphrases

• Thermal Modeling 100%
• Through Silicon via 100%
• Interposer 100%
• Electrical-thermal 100%
• Thermal Effect 33%
• Electrical Conductivity 16%
• Temperature Effect 16%
• Array Design 16%
• Silicon Substrate 16%
• Insertion Loss 16%
• Thermal Profile 16%
• 3D System 16%
• Temperature Estimation 16%
• Cascadic multigrid Method 16%
• Equivalent Thermal Conductivity 16%
• Cylindrical Modal Basis Function 16%
• Loss Parameters 16%