Electrically Detected Magnetic Resonance Study of High-Field Stress Induced Si/SiO2Interface Defects

Stephen J. Moxim, Patrick M. Lenahan, Fedor V. Sharov, Gaddi S. Haase, David R. Hughart

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We report electrically detected magnetic resonance (EDMR) results in metal-oxidesemiconductor field effect transistors before and after high field gate stressing. The measurements utilize EDMR detected through interface recombination currents. These interface recombination measurements provide information about one aspect of the stressing damage: The chemical and physical identity of trapping centers generated at and very near the interface. EDMR signal demonstrates that interface defects known as centers play important roles in the stress-induced damage.

Original languageEnglish (US)
Title of host publication2020 IEEE International Integrated Reliability Workshop, IIRW 2020
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728170589
DOIs
StatePublished - Oct 2020
Event2020 IEEE International Integrated Reliability Workshop, IIRW 2020 - Virtual, South Lake Tahoe, United States
Duration: Oct 4 2020Nov 1 2020

Publication series

NameIEEE International Integrated Reliability Workshop Final Report
Volume2020-October
ISSN (Print)1930-8841
ISSN (Electronic)2374-8036

Conference

Conference2020 IEEE International Integrated Reliability Workshop, IIRW 2020
Country/TerritoryUnited States
CityVirtual, South Lake Tahoe
Period10/4/2011/1/20

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality
  • Electronic, Optical and Magnetic Materials

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