Abstract
Electromagnetic interference (EMI) issues in implementing mixed-signal system-on-package (SOP) are investigated. Each of the testbeds utilized in our experimentations consists of a digital circuit and a RF front-end circuit with embedded passives, but they vary in terms of the route of the digital trace. With these testbeds, we demonstrate two different EMI mechanisms. The first results in EMI due to capacitive coupling through a small slot and intermodulation between the digital and RF signals. Even when the frequency of the digital signal is much lower than that of the RF signal, this mechanism causes new harmonics of the digital signal to appear around the frequency of the RF signal. The second mechanism produces EMI due to coupling through the common power bus in the package. To prevent such EMI issues, we describe differential signaling of the digital interface as our future work. Our results indicate the correct direction for EMI design in developing mixed-signal SOP.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 1437-1442 |
| Number of pages | 6 |
| Journal | Proceedings - Electronic Components and Technology Conference |
| Volume | 2 |
| State | Published - 2004 |
| Event | 2004 Proceedings - 54th Electronic Components and Technology Conference - Las Vegas, NV, United States Duration: Jun 1 2004 → Jun 4 2004 |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering