TY - GEN
T1 - Electromagnetic modeling of non-uniform through-silicon via (TSV) interconnections
AU - Xie, Biancun
AU - Swaminathan, Madhavan
PY - 2012
Y1 - 2012
N2 - In this paper, a hybrid approach for electromagnetic modeling of complex tapered through-silicon via (TSV) in three dimensional integrated circuits (3D ICs) is proposed. For complex TSV structures, TSVs are divided vertically into conical and cylindrical sections. The modeling of conical TSV is presented based on using conical modal basis functions. By using the conical TSV modeling method combined with cylindrical TSV modeling method, complex TSV structures can be modeled efficiently. The accuracy of this hybrid method is validated by comparison with 3-D full-wave simulations.
AB - In this paper, a hybrid approach for electromagnetic modeling of complex tapered through-silicon via (TSV) in three dimensional integrated circuits (3D ICs) is proposed. For complex TSV structures, TSVs are divided vertically into conical and cylindrical sections. The modeling of conical TSV is presented based on using conical modal basis functions. By using the conical TSV modeling method combined with cylindrical TSV modeling method, complex TSV structures can be modeled efficiently. The accuracy of this hybrid method is validated by comparison with 3-D full-wave simulations.
UR - http://www.scopus.com/inward/record.url?scp=84864135990&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84864135990&partnerID=8YFLogxK
U2 - 10.1109/SaPIW.2012.6222908
DO - 10.1109/SaPIW.2012.6222908
M3 - Conference contribution
AN - SCOPUS:84864135990
SN - 9781467315043
T3 - 2012 IEEE 16th Workshop on Signal and Power Integrity, SPI 2012 - Proceedings
SP - 43
EP - 46
BT - 2012 IEEE 16th Workshop on Signal and Power Integrity, SPI 2012 - Proceedings
T2 - 2012 IEEE 16th Workshop on Signal and Power Integrity, SPI 2012
Y2 - 13 May 2012 through 16 May 2012
ER -