Electromagnetic simulation of 3D stacked ICs: Full model vs. S-parameter cascaded based model

S. Piersanti, F. De Paulis, A. Ciccomancini Scogna, M. Swaminathan, A. Orlandi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Abstract

Three-dimensional electromagnetic simulation models are often simplified and/or segmented in order to reduce the simulation time and memory requirements without sacrificing the accuracy of the results. This paper investigates the difference between full model and S-parameter cascaded based model of 3D stacked ICs with the presence of Through Silicon Vias. It is found that the simulation of the full model is required for accurate results, however, a divide and conquers (segmentation) approach can be used for preliminary post layout analysis. Modeling guidelines are discussed and details on the proper choice of ports, boundary conditions, and solver technology are highlighted. A de-embedding methodology is finally explored to improve the accuracy of the cascaded/segmented results.

Original languageEnglish (US)
Title of host publication2014 IEEE International Symposium on Electromagnetic Compatibility, EMC 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages57-62
Number of pages6
EditionSeptember
ISBN (Electronic)9781479955442
DOIs
StatePublished - Sep 15 2014
Event2014 IEEE International Symposium on Electromagnetic Compatibility, EMC 2014 - Raleigh, United States
Duration: Aug 3 2014Aug 8 2014

Publication series

NameIEEE International Symposium on Electromagnetic Compatibility
NumberSeptember
Volume2014-September
ISSN (Print)1077-4076
ISSN (Electronic)2158-1118

Conference

Conference2014 IEEE International Symposium on Electromagnetic Compatibility, EMC 2014
Country/TerritoryUnited States
CityRaleigh
Period8/3/148/8/14

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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