TY - GEN
T1 - Electromagnetic simulation of 3D stacked ICs
T2 - 2014 IEEE International Symposium on Electromagnetic Compatibility, EMC 2014
AU - Piersanti, S.
AU - De Paulis, F.
AU - Scogna, A. Ciccomancini
AU - Swaminathan, M.
AU - Orlandi, A.
N1 - Publisher Copyright:
© 2014 IEEE.
PY - 2014/9/15
Y1 - 2014/9/15
N2 - Three-dimensional electromagnetic simulation models are often simplified and/or segmented in order to reduce the simulation time and memory requirements without sacrificing the accuracy of the results. This paper investigates the difference between full model and S-parameter cascaded based model of 3D stacked ICs with the presence of Through Silicon Vias. It is found that the simulation of the full model is required for accurate results, however, a divide and conquers (segmentation) approach can be used for preliminary post layout analysis. Modeling guidelines are discussed and details on the proper choice of ports, boundary conditions, and solver technology are highlighted. A de-embedding methodology is finally explored to improve the accuracy of the cascaded/segmented results.
AB - Three-dimensional electromagnetic simulation models are often simplified and/or segmented in order to reduce the simulation time and memory requirements without sacrificing the accuracy of the results. This paper investigates the difference between full model and S-parameter cascaded based model of 3D stacked ICs with the presence of Through Silicon Vias. It is found that the simulation of the full model is required for accurate results, however, a divide and conquers (segmentation) approach can be used for preliminary post layout analysis. Modeling guidelines are discussed and details on the proper choice of ports, boundary conditions, and solver technology are highlighted. A de-embedding methodology is finally explored to improve the accuracy of the cascaded/segmented results.
UR - http://www.scopus.com/inward/record.url?scp=84931837592&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84931837592&partnerID=8YFLogxK
U2 - 10.1109/ISEMC.2014.6898943
DO - 10.1109/ISEMC.2014.6898943
M3 - Conference contribution
AN - SCOPUS:84931837592
T3 - IEEE International Symposium on Electromagnetic Compatibility
SP - 57
EP - 62
BT - 2014 IEEE International Symposium on Electromagnetic Compatibility, EMC 2014
PB - Institute of Electrical and Electronics Engineers Inc.
Y2 - 3 August 2014 through 8 August 2014
ER -