Electromagnetic simulation of 3D stacked ICs: Full model vs. S-parameter cascaded based model

  • S. Piersanti
  • , F. De Paulis
  • , A. Ciccomancini Scogna
  • , M. Swaminathan
  • , A. Orlandi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Scopus citations

Fingerprint

Dive into the research topics of 'Electromagnetic simulation of 3D stacked ICs: Full model vs. S-parameter cascaded based model'. Together they form a unique fingerprint.

Engineering

Keyphrases

Material Science