Abstract
A new diamond deposition process utilizing a plasma and a variety of interactions from a multiple laser system has been demonstrated, with WC/Co substrates. The process is conducted in open air and does not involve hydrogen. Structural characterization of the diamond coatings, which have exceptional adhesion to cutting tool inserts, indicates a cubic diamond structure. Tungsten and cobalt atoms are incorporated into the film and a layer depleted in cobalt exists at the diamond-WC/Co interface. Electron field emission current densities reached 6mA/cm2 at an applied voltage of 3000 V for a film-anode distance 20 μm.
| Original language | English (US) |
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| Pages | 546-550 |
| Number of pages | 5 |
| State | Published - 1997 |
| Event | Proceedings of the 1997 10th International Vacuum Microelectronics Conference, IVMC'97 - Kyongju, Korea Duration: Aug 17 1997 → Aug 21 1997 |
Other
| Other | Proceedings of the 1997 10th International Vacuum Microelectronics Conference, IVMC'97 |
|---|---|
| City | Kyongju, Korea |
| Period | 8/17/97 → 8/21/97 |
All Science Journal Classification (ASJC) codes
- Surfaces and Interfaces