Abstract
Silicon nitride films with low defect densities can be prepared by plasma-enhanced chemical vapor deposition with ammonia-to-silane ratios adjusted to obtain N-rich materials. An electron-spin-resonance signal with g value close to 2.002 is reported for such materials, and the defect is identified as a Si atom coordinated to three N atoms as observed earlier in high-temperature chemical vapor deposited silicon nitride. Densities below 101 6 cm-3 are measured for substrate temperatures above 350°C for the first time. The distribution of defects is uniform through the film thickness. A surface defect density of 101 2 cm-2 has also been found in films deposited at 250°C.
Original language | English (US) |
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Pages (from-to) | 445-447 |
Number of pages | 3 |
Journal | Applied Physics Letters |
Volume | 52 |
Issue number | 6 |
DOIs | |
State | Published - 1988 |
All Science Journal Classification (ASJC) codes
- Physics and Astronomy (miscellaneous)