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Electronic applications for copper powder
John A. Shields, Ivi Smid
Engineering Science and Mechanics
Research output
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Contribution to journal
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Article
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peer-review
1
Scopus citations
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Keyphrases
Liquid Phase
100%
Electronic Applications
100%
Copper Powder
100%
Diamond
50%
Chromium
50%
Processing Stages
50%
Tungsten-copper
50%
Sintered Composite
50%
Solid-state Device
50%
Molybdenum-copper
50%
Tungsten
25%
Graphite
25%
Rutile
25%
Molybdenum
25%
Detrimental Effects
25%
Thermal Expansion
25%
Mechanical Interaction
25%
Sintered Materials
25%
Diffusion Barrier
25%
Suicide
25%
Improved Process
25%
Low Resistivity
25%
Operating Temperature
25%
Bond Strength
25%
Wiring
25%
Fast Response
25%
Promising Solutions
25%
Processing Temperature
25%
Oxidation Resistance
25%
Laser Machining
25%
Processing Cost
25%
Heat Sink
25%
Machinability
25%
Pure Copper
25%
Pre-sintering
25%
Forming Technology
25%
Large-area Display
25%
Interfacial Bonding
25%
Tantalum
25%
Process Yield
25%
Reactive Metals
25%
Direct Computation
25%
Sputtered Films
25%
Alloying Effect
25%
Refractory Alloys
25%
Diamond Composite
25%
Net-shape Forming
25%
Material Science
Composite Material
100%
Copper Powder
100%
Diamond
42%
Tungsten
42%
Chromium
28%
Molybdenum
28%
Machining
28%
Alloying
28%
Solid State Device
28%
Titanium
14%
Electronic Circuit
14%
Refractory Metal
14%
Electrical Resistance
14%
Thermal Expansion
14%
Alloy
14%
Oxidation Resistance
14%
Machinability
14%
Tantalum
14%
Sputtered Film
14%
Molybdenum Alloys
14%