TY - GEN
T1 - Electronics anywhere
AU - Jackson, Thomas Nelson
PY - 2004
Y1 - 2004
N2 - The recent technological advancements has lead to a widespread explosion of electronics anywhere applications. The details of device structures, performance, and electrical and environmental stability are critically related to the success of various application possibilities. Many substrates in addition to high temperature polymers are of interest for electronics anywhere applications including low temperature polymers, papers and cloth. An evolutionary approach to electronics anywhere is very much practical, and the fabrication of devices and systems on arbitrary substrates is expected to require some process modification.
AB - The recent technological advancements has lead to a widespread explosion of electronics anywhere applications. The details of device structures, performance, and electrical and environmental stability are critically related to the success of various application possibilities. Many substrates in addition to high temperature polymers are of interest for electronics anywhere applications including low temperature polymers, papers and cloth. An evolutionary approach to electronics anywhere is very much practical, and the fabrication of devices and systems on arbitrary substrates is expected to require some process modification.
UR - http://www.scopus.com/inward/record.url?scp=18144386223&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=18144386223&partnerID=8YFLogxK
U2 - 10.1109/DRC.2004.1367756
DO - 10.1109/DRC.2004.1367756
M3 - Conference contribution
AN - SCOPUS:18144386223
SN - 0780382846
T3 - Device Research Conference - Conference Digest, DRC
SP - 7
EP - 10
BT - Device Research Conference - Conference Digest, 62nd DRC
T2 - Device Research Conference - Conference Digest, 62nd DRC
Y2 - 21 June 2004 through 23 June 2004
ER -