Engineering novel infrared glass ceramics for advanced optical solutions

K. Richardson, A. Buff, C. Smith, L. Sisken, J. David Musgraves, P. Wachtel, T. Mayer, A. Swisher, A. Pogrebnyakov, M. Kang, C. Pantano, D. Werner, A. Kirk, S. Aiken, C. Rivero-Baleine

Research output: Chapter in Book/Report/Conference proceedingConference contribution

14 Scopus citations


Advanced photonic devices require novel optical materials that serve specified optical function but also possess attributes which can be tailored to accommodate specific optical design, manufacturing or component/device integration constraints. Multi-component chalcogenide glass (ChG) materials have been developed which exhibit broad spectral transparency with a range of physical properties that can be tuned to vary with composition, material microstructure and form. Specific tradeoffs that highlight the impact of material morphology and optical properties including transmission, loss and refractive index, are presented. This paper reports property evolution in a representative 20 GeSe2-60 As2Se3-20 PbSe glass material including a demonstration of a 1D GRIN profile through the use of controlled crystallization.

Original languageEnglish (US)
Title of host publicationAdvanced Optics for Defense Applications
Subtitle of host publicationUV through LWIR
EditorsPeter L. Marasco, Bjorn F. Andresen, Jay N. Vizgaitis, Jasbinder S. Sanghera, Miguel P. Snyder
ISBN (Electronic)9781510600638
StatePublished - 2016
EventAdvanced Optics for Defense Applications: UV through LWIR - Baltimore, United States
Duration: Apr 17 2016Apr 19 2016

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X


OtherAdvanced Optics for Defense Applications: UV through LWIR
Country/TerritoryUnited States

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering


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