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Engineering the Al-Ti/p-SiC Ohmic contact for improved performance
J. Y. Lin
,
S. E. Mohney
, M. Smalley
, J. Crofton
, J. Crofton
, J. R. Williams
, T. Isaacs-Smith
Materials Science and Engineering
Materials Research Institute (MRI)
Research output
:
Contribution to journal
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Article
›
peer-review
Overview
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Keyphrases
Ohmic Contact
100%
Performance Improvement
100%
Al-Ti
100%
Annealing
75%
Specific Contact Resistance
50%
Ohmic
50%
Order of Magnitude
25%
High Temperature
25%
Metallization
25%
Cm(III)
25%
Severe Disease
25%
Surface Morphology
25%
Mean Square
25%
CrB2
25%
Ohmic Behavior
25%
Capping Layer
25%
Ti Contact
25%
Interfacial Roughness
25%
Evaporative Loss
25%
Evaporation of Al
25%
TiAl3
25%
Contact Metallization
25%
Contact Layer
25%
Edge Definition
25%
Engineering
Engineering
100%
Ohmic Contacts
100%
Phase Composition
100%
Metallizations
66%
Conductive
33%
Surface Morphology
33%
Edge Definition
33%
Evaporative Loss
33%
Surface Edge
33%
Rich Liquid
33%
Cap Layer
33%
Material Science
Phase Composition
100%
Contact Resistance
66%
Annealing
33%
Surface Morphology
33%