Abstract
Extremely smooth (6 nm RMS roughness over 4 μm2), thin (100 nm), and continuous ultrananocrystalline diamond (UNCD) films were synthesized by microwave plasma chemical vapor deposition using a 10 nm tungsten (W) interlayer between the silicon substrate and the diamond film. These UNCD films possess a high content of sp3-bonded carbon. The W interlayer significantly increased the initial diamond nucleation density, thereby lowering the surface roughness, eliminating interfacial voids, and allowing thinner UNCD films to be grown. This structural optimization enhances the films' properties and enables its integration with a wide variety of substrate materials.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 345-350 |
| Number of pages | 6 |
| Journal | Chemical Physics Letters |
| Volume | 430 |
| Issue number | 4-6 |
| DOIs | |
| State | Published - Oct 30 2006 |
All Science Journal Classification (ASJC) codes
- General Physics and Astronomy
- Physical and Theoretical Chemistry
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