Abstract
A novel double sided silicon interposer for low impedance power delivery is presented. In this letter, a model for power ground planes in inhomogeneous dielectrics with conductive subsections using the multi-layered finite difference method (M-FDM) is presented. Benefits of the silicon interposer in mitigating signal integrity issues arising due to return path discontinuities (RPDs) are also discussed for the first time along with a comparison to glass interposer.
| Original language | English (US) |
|---|---|
| Article number | 6034541 |
| Pages (from-to) | 598-600 |
| Number of pages | 3 |
| Journal | IEEE Microwave and Wireless Components Letters |
| Volume | 21 |
| Issue number | 11 |
| DOIs | |
| State | Published - Nov 2011 |
All Science Journal Classification (ASJC) codes
- Condensed Matter Physics
- Electrical and Electronic Engineering