Environmental and thermal aging of Au/Ni/p-GaN ohmic contacts annealed in air

Keyphrases

• Aging 20%
• Aging Studies 20%
• Annealing 100%
• Au-Ni 100%
• Contact Metallization 40%
• Current-voltage Characteristics 20%
• Degradation Mechanism 20%
• Depth Profile 20%
• Dry Air 20%
• Dry Oxygen 20%
• Environmental Degradation 40%
• Four-point Probe 20%
• Gas-saturated 20%
• High Transparency 20%
• Hole Concentration 20%
• Hydroxyl Group 20%
• Nitrogen Gas 40%
• Ohmic Contact 100%
• Room Temperature 60%
• Sheet Resistance 20%
• Specific Contact Resistance 20%
• Temperature Degradation 20%
• Thermal Degradation 20%
• Thermal Stability 20%
• Water Vapor 100%
• X-ray Photoelectron Spectroscopy 20%

Engineering

• Current-Voltage Characteristic 33%
• Degradation Mechanism 33%
• Depth Profile 33%
• Dry Air 33%
• Hole Concentration 33%
• Metallizations 66%
• Ohmic Contacts 100%
• Probe Point 33%
• Ray Photoelectron Spectroscopy 33%
• Resistive 33%
• Room Temperature 100%
• Sheet Resistance 33%
• Thermal Degradation 33%

Material Science

• Contact Resistance 20%
• Current Voltage Characteristics 20%
• Hole Concentration 20%
• Photoemission Spectroscopy 20%
• Thermal Degradation 20%
• Thermal Stability 20%
• Water Vapor 100%