Epoxy Resin with Metal Complex Additives for Improved Reliability of Epoxy-Copper Joint

Keyphrases

• Epoxy Resin 100%
• Epoxy 100%
• Increased Reliability 100%
• Copper Joints 100%
• Metal Complexes 100%
• Thermomechanical 33%
• Coordination Bond 33%
• Assembly Process 33%
• Mechanistic Insight 33%
• Temperature-humidity Index 33%
• Coupling Agent 33%
• Power Density 33%
• Polymer Backbone 33%
• Wide Band Gap Semiconductors 33%
• Delamination 33%
• Failure Mechanism 33%
• Moisture 33%
• Limited Access 33%
• Covalent Bond 33%
• Power Packaging 33%
• Power Device 33%
• Fast Pace 33%
• High Temperature Operation 33%
• Operation Voltage 33%
• Coordination Compounds 33%
• Operation Environment 33%
• Moisture Resistance 33%
• Hydrogen Bond Formation 33%
• Stable Mechanism 33%
• Chemical Assessment 33%
• Major Failure 33%
• Adhesion Performance 33%
• Device Miniaturization 33%

Engineering

• Joints (Structural Components) 100%
• Pretreatment 50%
• Power Density 50%
• Assembly Process 50%
• Failure Mechanism 50%
• Coupling Agent 50%
• Polymer Backbone 50%
• Covalent 50%
• Bond Formation 50%
• High Temperature Operations 50%
• Wide Bandgap Semiconductor 50%
• Delamination 50%
• Moisture Resistance 50%

Material Science

• Epoxy 100%
• Density 33%
• Hydrogen Bonding 33%
• Coupling Agent 33%
• Covalent Bond 33%
• Coordination Compound 33%
• Wide Bandgap Semiconductor 33%
• Enzymatic Hydrolysis 33%
• Delamination 33%