Evaluation of Parylene-HT as Dielectric for Application in Advanced Package Substrates

Pratik Nimbalkar, Mercy Aguebor, Mohanalingam Kathaperumal, Madhavan Swaminathan, Rao Tummala

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

Polymer dielectrics having low dielectric constants are necessary for next-generation package substrates to achieve lower losses and higher bandwidth densities. Conventional silica-filled dielectrics have higher dielectric constants due to the silica fillers. Therefore, it is important to explore novel dielectric materials for next-generation package substrates that have lower dielectric constants. Parylenes have a unique set of properties such as- very low moisture absorption, low gas permeability, conformal deposition, and heat resistance. Some parylenes also have a very low dielectric constant, low dielectric dissipation losses and low roughness that make them attractive as dielectrics for application in advanced package substrates. Amongst all parylenes, Parylene-Hthas the lowest dielectric constant (Dk) of 2.17 and dissipation factor (Df) of 0.001 at 1 MHz, thus making it attractive for high-frequency applications. However, there are several challenges associated with the use of polymer dielectrics in package substrates such as- adhesion to Cu, via formation ability, processability, mechanical reliability and electrical reliability. This paper evaluates Parylene- Htwith respect to all these challenges.

Original languageEnglish (US)
Title of host publicationProceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1603-1608
Number of pages6
ISBN (Electronic)9798350334982
DOIs
StatePublished - 2023
Event73rd IEEE Electronic Components and Technology Conference, ECTC 2023 - Orlando, United States
Duration: May 30 2023Jun 2 2023

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2023-May
ISSN (Print)0569-5503

Conference

Conference73rd IEEE Electronic Components and Technology Conference, ECTC 2023
Country/TerritoryUnited States
CityOrlando
Period5/30/236/2/23

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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