Evaluation of test methods employed for characterizing semi-insulating nature of monocrystaline SiC semiconductor materials

M. F. MacMillan, W. Mitchel, J. Blevins, G. Landis, J. Daniel, R. S. Sandhu, G. Chung, M. Spaulding, T. F. Zoes, E. Emorhokpor, C. Basceri, J. Jenny, E. Berkman, Wolfgang Jantz, W. Eichhorn, A. Blew, J. D. Oliver, Mark Fanton, Tim Bogart, Bill Eversson

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Silicon carbide (SiC) substrates offer an attractive template for the development of gallium nitride-based semiconductor materials device technologies for the advancement of high power solid-state microwave and millimeter wave circuits in the commercial and military defense markets. To ensure that the resistivity specifications of semi insulating (SI) are accurately determined and reported, the SEMI North American SiC Task Force has completed a first round robin test activity which includes evaluating contact and non-contact test methods employed to report high resistivity values for SiC semiconductor materials. Results from the round robin are aligned with customer requirements for the development of a semi-insulating specification and test method for SiC substrates.

Original languageEnglish (US)
Title of host publication2008 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2008
StatePublished - 2008
Event23rd International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2008 - Chicago, IL, United States
Duration: Apr 14 2008Apr 17 2008

Publication series

Name2008 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2008

Other

Other23rd International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2008
Country/TerritoryUnited States
CityChicago, IL
Period4/14/084/17/08

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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