TY - GEN
T1 - Experimental and numerical results for diffusion bonded joints
AU - Rahman, A. H.M.E.
AU - Cavalli, M. N.
PY - 2011
Y1 - 2011
N2 - Commercially pure Fe and Ni have been diffusion bonded. Pure Cu (99.999%) and Au-20Sn eutectic alloys have been used to bond Fe while Cu has been used to bond Ni. Fe bonded using Cu at 1071 °C for 10 h showed ∼20 μm thick residual Cu in the bond centerline. However, at 1100°C bonding temperature for 10 h the residual Cu disappeared and the Cu content of the joint centerline was ∼7wt.%. Although Sn forms intermetallics with both Fe and Au, no intermetallics were found when Au-20Sn eutectic was used to bond Fe at 600-650°C for 10h. Ni bonded at 1071°C for 10h contained 40 wt.% Cu in the joint centerline with the Cu content decreasing gradually with increasing distance from the bondline. Cu content in the bond centerline decreased to 35wt.% at 1100°C for 10 h. The concentration profiles of Cu in a Ni-Cu diffusion couple were simulated with DICTRA/Thermocalc The simulated profiles were comparable to the experimental profiles. The ultimate tensile strengths obtained for Fe-Cu system were 245 and 276 MPa at 1085±1 and 1090±1°C for 10 h, respectively.
AB - Commercially pure Fe and Ni have been diffusion bonded. Pure Cu (99.999%) and Au-20Sn eutectic alloys have been used to bond Fe while Cu has been used to bond Ni. Fe bonded using Cu at 1071 °C for 10 h showed ∼20 μm thick residual Cu in the bond centerline. However, at 1100°C bonding temperature for 10 h the residual Cu disappeared and the Cu content of the joint centerline was ∼7wt.%. Although Sn forms intermetallics with both Fe and Au, no intermetallics were found when Au-20Sn eutectic was used to bond Fe at 600-650°C for 10h. Ni bonded at 1071°C for 10h contained 40 wt.% Cu in the joint centerline with the Cu content decreasing gradually with increasing distance from the bondline. Cu content in the bond centerline decreased to 35wt.% at 1100°C for 10 h. The concentration profiles of Cu in a Ni-Cu diffusion couple were simulated with DICTRA/Thermocalc The simulated profiles were comparable to the experimental profiles. The ultimate tensile strengths obtained for Fe-Cu system were 245 and 276 MPa at 1085±1 and 1090±1°C for 10 h, respectively.
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U2 - 10.1007/978-1-4614-0222-0_65
DO - 10.1007/978-1-4614-0222-0_65
M3 - Conference contribution
AN - SCOPUS:84857830587
SN - 9781461402213
T3 - Conference Proceedings of the Society for Experimental Mechanics Series
SP - 545
EP - 551
BT - Experimental and Applied Mechanics - Proceedings of the 2011 Annual Conference on Experimental and Applied Mechanics
PB - Springer New York LLC
T2 - 2011 SEM Annual Conference on Experimental and Applied Mechanics
Y2 - 13 June 2011 through 16 June 2011
ER -