Abstract
A vertical device architecture having ∼40% density improvement over planar for sub-10nm technology node has been evaluated for Si NMOS and III-V HTFET with L g=16nm. For LOP applications including the effect of parasitic elements, the HTFET presents superior energy efficiency and desired low-power analog performance for V DD<60;0.6V, while MOSFET is superior for V DD>0.6V. To further improve MOSFET performance, I ON needs to be improved with higher injection velocity materials (e.g. III-V). For delay reduction, the parasitic capacitances (C ov and C g,fringe) and contact resistance need to be further engineered for both MOSFETs and TFETs.
| Original language | English (US) |
|---|---|
| Title of host publication | 70th Device Research Conference, DRC 2012 - Conference Digest |
| Pages | 233-234 |
| Number of pages | 2 |
| DOIs | |
| State | Published - 2012 |
| Event | 70th Device Research Conference, DRC 2012 - University Park, PA, United States Duration: Jun 18 2012 → Jun 20 2012 |
Publication series
| Name | Device Research Conference - Conference Digest, DRC |
|---|---|
| ISSN (Print) | 1548-3770 |
Other
| Other | 70th Device Research Conference, DRC 2012 |
|---|---|
| Country/Territory | United States |
| City | University Park, PA |
| Period | 6/18/12 → 6/20/12 |
UN SDGs
This output contributes to the following UN Sustainable Development Goals (SDGs)
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SDG 7 Affordable and Clean Energy
All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering
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