Abstract
Adhesives with dielectric loss are needed for microwave-assisted joining of polymeric substances. The dielectric loss in an otherwise suitable adhesive may be en hanced by doping it with fine metallic particles. Here we use a recently extended Maxwell Garnett formalism to estimate the complex dielectric constant of a metal-doped composite adhesive, with specific focus on the imaginary part of the dielectric constant of the com posite adhesive.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 1203-1213 |
| Number of pages | 11 |
| Journal | Journal of Composite Materials |
| Volume | 27 |
| Issue number | 12 |
| DOIs | |
| State | Published - Dec 1993 |
All Science Journal Classification (ASJC) codes
- Ceramics and Composites
- Mechanics of Materials
- Mechanical Engineering
- Materials Chemistry
Fingerprint
Dive into the research topics of 'Extended Maxwell Garnett Formalism for Composite Adhesives for Microwave-Assisted Adhesion of Polymer Surfaces'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver