Extraction of material properties for low-K and low-loss dielectrics using cavity resonator and efficient finite difference solver up to 40GHz

Seunghyun E. Hwang; Madhavan Swaminathan; Venkatesan Venkatakrishnan

doi:10.1109/EDAPS.2008.4735997

Extraction of material properties for low-K and low-loss dielectrics using cavity resonator and efficient finite difference solver up to 40GHz

Seunghyun E. Hwang, Madhavan Swaminathan, Venkatesan Venkatakrishnan

Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Scopus citations

Abstract

Liquid crystal polymer (LCP) has been used as an RF substrate material for the packaging. As the technology continues to improve, LCP does not satisfy all of the thickness requirements for mobile applications. Therefore, a new dielectric material (Material-A) has been developed, which can be extremely thin and has a lower processing temperature than LCP. To accurately extract Material-A properties, we present a new extraction method which has a major advantage over the previously published techniques especially for low dielectric and low loss dielectrics. In this paper, the new method has been applied for extracting the frequency-dependent dielectric constant and loss tangent up to 40GHz for Material-A, and a Debye model that satisfies the causality has been developed.

Original language	English (US)
Title of host publication	2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings
Pages	53-56
Number of pages	4
DOIs	https://doi.org/10.1109/EDAPS.2008.4735997
State	Published - 2008
Event	2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Seoul, Korea, Republic of Duration: Dec 10 2008 → Dec 12 2008

Publication series

Name	2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings

Conference

Conference	2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008
Country/Territory	Korea, Republic of
City	Seoul
Period	12/10/08 → 12/12/08

All Science Journal Classification (ASJC) codes

Control and Systems Engineering
Electrical and Electronic Engineering

Access to Document

10.1109/EDAPS.2008.4735997

Cite this

Hwang, S. E., Swaminathan, M., & Venkatakrishnan, V. (2008). Extraction of material properties for low-K and low-loss dielectrics using cavity resonator and efficient finite difference solver up to 40GHz. In 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings (pp. 53-56). Article 4735997 (2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings). https://doi.org/10.1109/EDAPS.2008.4735997

Hwang, Seunghyun E. ; Swaminathan, Madhavan ; Venkatakrishnan, Venkatesan. / Extraction of material properties for low-K and low-loss dielectrics using cavity resonator and efficient finite difference solver up to 40GHz. 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings. 2008. pp. 53-56 (2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings).

@inproceedings{3a9fe000a55a4b6d9547a86c1a0895fe,

title = "Extraction of material properties for low-K and low-loss dielectrics using cavity resonator and efficient finite difference solver up to 40GHz",

abstract = "Liquid crystal polymer (LCP) has been used as an RF substrate material for the packaging. As the technology continues to improve, LCP does not satisfy all of the thickness requirements for mobile applications. Therefore, a new dielectric material (Material-A) has been developed, which can be extremely thin and has a lower processing temperature than LCP. To accurately extract Material-A properties, we present a new extraction method which has a major advantage over the previously published techniques especially for low dielectric and low loss dielectrics. In this paper, the new method has been applied for extracting the frequency-dependent dielectric constant and loss tangent up to 40GHz for Material-A, and a Debye model that satisfies the causality has been developed.",

author = "Hwang, {Seunghyun E.} and Madhavan Swaminathan and Venkatesan Venkatakrishnan",

year = "2008",

doi = "10.1109/EDAPS.2008.4735997",

language = "English (US)",

isbn = "9781424426331",

series = "2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings",

pages = "53--56",

booktitle = "2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings",

note = "2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 ; Conference date: 10-12-2008 Through 12-12-2008",

}

Hwang, SE, Swaminathan, M & Venkatakrishnan, V 2008, Extraction of material properties for low-K and low-loss dielectrics using cavity resonator and efficient finite difference solver up to 40GHz. in 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings., 4735997, 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings, pp. 53-56, 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008, Seoul, Korea, Republic of, 12/10/08. https://doi.org/10.1109/EDAPS.2008.4735997

Extraction of material properties for low-K and low-loss dielectrics using cavity resonator and efficient finite difference solver up to 40GHz. / Hwang, Seunghyun E.; Swaminathan, Madhavan; Venkatakrishnan, Venkatesan.
2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings. 2008. p. 53-56 4735997 (2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Extraction of material properties for low-K and low-loss dielectrics using cavity resonator and efficient finite difference solver up to 40GHz

AU - Hwang, Seunghyun E.

AU - Swaminathan, Madhavan

AU - Venkatakrishnan, Venkatesan

PY - 2008

Y1 - 2008

N2 - Liquid crystal polymer (LCP) has been used as an RF substrate material for the packaging. As the technology continues to improve, LCP does not satisfy all of the thickness requirements for mobile applications. Therefore, a new dielectric material (Material-A) has been developed, which can be extremely thin and has a lower processing temperature than LCP. To accurately extract Material-A properties, we present a new extraction method which has a major advantage over the previously published techniques especially for low dielectric and low loss dielectrics. In this paper, the new method has been applied for extracting the frequency-dependent dielectric constant and loss tangent up to 40GHz for Material-A, and a Debye model that satisfies the causality has been developed.

AB - Liquid crystal polymer (LCP) has been used as an RF substrate material for the packaging. As the technology continues to improve, LCP does not satisfy all of the thickness requirements for mobile applications. Therefore, a new dielectric material (Material-A) has been developed, which can be extremely thin and has a lower processing temperature than LCP. To accurately extract Material-A properties, we present a new extraction method which has a major advantage over the previously published techniques especially for low dielectric and low loss dielectrics. In this paper, the new method has been applied for extracting the frequency-dependent dielectric constant and loss tangent up to 40GHz for Material-A, and a Debye model that satisfies the causality has been developed.

UR - http://www.scopus.com/inward/record.url?scp=60649086592&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=60649086592&partnerID=8YFLogxK

U2 - 10.1109/EDAPS.2008.4735997

DO - 10.1109/EDAPS.2008.4735997

M3 - Conference contribution

AN - SCOPUS:60649086592

SN - 9781424426331

T3 - 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings

SP - 53

EP - 56

BT - 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings

T2 - 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008

Y2 - 10 December 2008 through 12 December 2008

ER -

Hwang SE, Swaminathan M, Venkatakrishnan V. Extraction of material properties for low-K and low-loss dielectrics using cavity resonator and efficient finite difference solver up to 40GHz. In 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings. 2008. p. 53-56. 4735997. (2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings). doi: 10.1109/EDAPS.2008.4735997

Extraction of material properties for low-K and low-loss dielectrics using cavity resonator and efficient finite difference solver up to 40GHz

Abstract

Publication series

Conference

All Science Journal Classification (ASJC) codes

Access to Document

Other files and links

Fingerprint

Cite this