Fabrication and Characterization of Package Embedded Inductors for Integrated Voltage Regulators

Prahalad Murali, Venkatesh Avula, Marisa Ahmed, Mark D. Losego, Madhavan Swaminathan, Claudio Alvarez, Yusuke Oishi, Tomohito Uemura, Ryo Nagatsuka, Naoki Watanabe

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

As data centers become more energy efficient, there is a need to improve the power delivery network (PDN) efficiency. Current efficiencies for the 48 V to 1 V multi-stage conversion systems can be as low as 75% or lower, because of multiple down conversion stages and high currents passing through the mother board. Previously, we proposed an inductor power loss metric to characterize the inductors using a custom-built measurement board that considers the small signal response (with and without DC bias) and large signal measurements. In this work, we compare 4 different magnetic materials, HBS1, XVSZ2, XVSZ3 and XVSZ4 (courtesy of Panasonic) in the form of metal polymer composite sheets of 400 μm thickness to fabricate and test the embedded inductors. To increase the inductance of the embedded toroidal inductors, we increase the number of windings along with an increase in the number of cylindrical vias. The new inductors have small dimensions and have high inductances in the range of 200 - 600 nH. They provide a maximum inductance density of 68 nH/mm2 with a current per inductor greater than 2.5 A and 84.7% inductor efficiency. To decrease the DC resistance of the inductors, the copper thickness used is 50 μm.

Original languageEnglish (US)
Title of host publicationProceedings - IEEE 72nd Electronic Components and Technology Conference, ECTC 2022
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages301-305
Number of pages5
ISBN (Electronic)9781665479431
DOIs
StatePublished - 2022
Event72nd IEEE Electronic Components and Technology Conference, ECTC 2022 - San Diego, United States
Duration: May 31 2022Jun 3 2022

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2022-May
ISSN (Print)0569-5503

Conference

Conference72nd IEEE Electronic Components and Technology Conference, ECTC 2022
Country/TerritoryUnited States
CitySan Diego
Period5/31/226/3/22

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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