TY - GEN
T1 - Fabrication and Characterization of Package Embedded Inductors for Integrated Voltage Regulators
AU - Murali, Prahalad
AU - Avula, Venkatesh
AU - Ahmed, Marisa
AU - Losego, Mark D.
AU - Swaminathan, Madhavan
AU - Alvarez, Claudio
AU - Oishi, Yusuke
AU - Uemura, Tomohito
AU - Nagatsuka, Ryo
AU - Watanabe, Naoki
N1 - Funding Information:
This work was supported in part by ASCENT, one of six centers in JUMP, a Semiconductor Research Corporation (SRC) program sponsored by DARPA. The authors wish to acknowledge the fabrication support provided by the Georgia Tech Packaging Research Center (PRC) consortium members and the Institute for Electronics and Nanotechnology (IEN) of Georgia Institute of Technology. The authors want to thank Kaladhar Radhakrishnan and Krishna Bharath from Intel Corporation for their mentoring support and Sridhar Sivapurapu for helping with the measurement setup.
Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - As data centers become more energy efficient, there is a need to improve the power delivery network (PDN) efficiency. Current efficiencies for the 48 V to 1 V multi-stage conversion systems can be as low as 75% or lower, because of multiple down conversion stages and high currents passing through the mother board. Previously, we proposed an inductor power loss metric to characterize the inductors using a custom-built measurement board that considers the small signal response (with and without DC bias) and large signal measurements. In this work, we compare 4 different magnetic materials, HBS1, XVSZ2, XVSZ3 and XVSZ4 (courtesy of Panasonic) in the form of metal polymer composite sheets of 400 μm thickness to fabricate and test the embedded inductors. To increase the inductance of the embedded toroidal inductors, we increase the number of windings along with an increase in the number of cylindrical vias. The new inductors have small dimensions and have high inductances in the range of 200 - 600 nH. They provide a maximum inductance density of 68 nH/mm2 with a current per inductor greater than 2.5 A and 84.7% inductor efficiency. To decrease the DC resistance of the inductors, the copper thickness used is 50 μm.
AB - As data centers become more energy efficient, there is a need to improve the power delivery network (PDN) efficiency. Current efficiencies for the 48 V to 1 V multi-stage conversion systems can be as low as 75% or lower, because of multiple down conversion stages and high currents passing through the mother board. Previously, we proposed an inductor power loss metric to characterize the inductors using a custom-built measurement board that considers the small signal response (with and without DC bias) and large signal measurements. In this work, we compare 4 different magnetic materials, HBS1, XVSZ2, XVSZ3 and XVSZ4 (courtesy of Panasonic) in the form of metal polymer composite sheets of 400 μm thickness to fabricate and test the embedded inductors. To increase the inductance of the embedded toroidal inductors, we increase the number of windings along with an increase in the number of cylindrical vias. The new inductors have small dimensions and have high inductances in the range of 200 - 600 nH. They provide a maximum inductance density of 68 nH/mm2 with a current per inductor greater than 2.5 A and 84.7% inductor efficiency. To decrease the DC resistance of the inductors, the copper thickness used is 50 μm.
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U2 - 10.1109/ECTC51906.2022.00056
DO - 10.1109/ECTC51906.2022.00056
M3 - Conference contribution
AN - SCOPUS:85134645749
T3 - Proceedings - Electronic Components and Technology Conference
SP - 301
EP - 305
BT - Proceedings - IEEE 72nd Electronic Components and Technology Conference, ECTC 2022
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 72nd IEEE Electronic Components and Technology Conference, ECTC 2022
Y2 - 31 May 2022 through 3 June 2022
ER -