High-efficiency integrated voltage regulators (IVRs) require the integration of power inductors, which have low loss and reduced size at very high frequency. The use of a magnetic material core can reduce significantly the inductor area and simultaneously increase the inductance. This paper focuses on the fabrication, characterization and modeling of nickel zinc (NiZn) ferrite and carbonyl iron powder (CIP)-epoxy magnetic composite materials, which are used as the magnetic core materials of embedded inductors in a printed wiring board (PWB) for a system in package (SIP) based buck type IVR. The fabricated composite materials and process are fully compatible with FR4 epoxy resin prepreg and laminate. For 85% weight loading of the magnetic powder (around 100 MHz at room temperature), the composite materials show a relative permeability of 7.5-8.1 for the NiZn ferrite composite and 5.2-5.6 for the CIP composite and a loss tangent value of 0.24-0.28 for the NiZn ferrite composite and 0.09-0.1 for the CIP-composite. The room temperature saturation flux density values are 0.1351 T and 0.5280 T for the NiZn ferrite and the CIP composites, respectively. The frequency dispersion parameters of the magnetic composites are modeled using a simplified Lorentz and Landau-Lifshitz-Gilbert equation for a Debye type relaxation. Embedded magnetic core solenoid inductors were designed based on the composite materials for the output filter of a high-efficiency SIP based buck type IVR. Evaluation of a SIP based buck type IVR with the designed inductors shows that it can reach peak efficiencies of 91.7% at 11 MHz for the NiZn ferrite-composite, 91.6% at 14 MHz for CIP-composite and 87.5% (NiZn ferrite-composite) and 87.3% (CIP-composite) efficiency at 100 MHz for a 1.7 V:1.05 V conversion. For a direct 5 V:1 V conversion using a stacked topology, a peak efficiency of 82% at 10 MHz and 72% efficiency at 100 MHz can be achieved for both materials.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Acoustics and Ultrasonics
- Surfaces, Coatings and Films