Fast electrical-thermal co-simulation using multigrid method for 3D integration

Jianyong Xie; Madhavan Swaminathan

doi:10.1109/ECTC.2012.6248901

Fast electrical-thermal co-simulation using multigrid method for 3D integration

Jianyong Xie
, Madhavan Swaminathan

Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

11 Scopus citations

Abstract

In this paper, a fast electrical-thermal co-simulation method based on multigrid approach is proposed for simulating 3D systems. Using the proposed approach, accurate voltage/current distribution with temperature effect as well as temperature distribution with Joule heating effect can be obtained efficiently. By ensuring smoothly stretched gridding between die region and package region, fast convergence of multigrid method can be reached for both DC voltage drop and thermal simulations. The effect of nonuniform gridding on the convergence of multigrid is studied. The temperature effect on voltage drop and Joule heating effect on localized hotspot are discussed.

Original language	English (US)
Title of host publication	2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012
Pages	651-657
Number of pages	7
DOIs	https://doi.org/10.1109/ECTC.2012.6248901
State	Published - 2012
Event	2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012 - San Diego, CA, United States Duration: May 29 2012 → Jun 1 2012

Publication series

Name	Proceedings - Electronic Components and Technology Conference
ISSN (Print)	0569-5503

Conference

Conference	2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012
Country/Territory	United States
City	San Diego, CA
Period	5/29/12 → 6/1/12

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

10.1109/ECTC.2012.6248901

Cite this

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title = "Fast electrical-thermal co-simulation using multigrid method for 3D integration",

abstract = "In this paper, a fast electrical-thermal co-simulation method based on multigrid approach is proposed for simulating 3D systems. Using the proposed approach, accurate voltage/current distribution with temperature effect as well as temperature distribution with Joule heating effect can be obtained efficiently. By ensuring smoothly stretched gridding between die region and package region, fast convergence of multigrid method can be reached for both DC voltage drop and thermal simulations. The effect of nonuniform gridding on the convergence of multigrid is studied. The temperature effect on voltage drop and Joule heating effect on localized hotspot are discussed.",

author = "Jianyong Xie and Madhavan Swaminathan",

year = "2012",

doi = "10.1109/ECTC.2012.6248901",

language = "English (US)",

isbn = "9781467319669",

series = "Proceedings - Electronic Components and Technology Conference",

pages = "651--657",

booktitle = "2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012",

note = "2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012 ; Conference date: 29-05-2012 Through 01-06-2012",

}

Xie, J & Swaminathan, M 2012, Fast electrical-thermal co-simulation using multigrid method for 3D integration. in 2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012., 6248901, Proceedings - Electronic Components and Technology Conference, pp. 651-657, 2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012, San Diego, CA, United States, 5/29/12. https://doi.org/10.1109/ECTC.2012.6248901

Fast electrical-thermal co-simulation using multigrid method for 3D integration. / Xie, Jianyong; Swaminathan, Madhavan.
2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012. 2012. p. 651-657 6248901 (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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AU - Swaminathan, Madhavan

PY - 2012

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N2 - In this paper, a fast electrical-thermal co-simulation method based on multigrid approach is proposed for simulating 3D systems. Using the proposed approach, accurate voltage/current distribution with temperature effect as well as temperature distribution with Joule heating effect can be obtained efficiently. By ensuring smoothly stretched gridding between die region and package region, fast convergence of multigrid method can be reached for both DC voltage drop and thermal simulations. The effect of nonuniform gridding on the convergence of multigrid is studied. The temperature effect on voltage drop and Joule heating effect on localized hotspot are discussed.

AB - In this paper, a fast electrical-thermal co-simulation method based on multigrid approach is proposed for simulating 3D systems. Using the proposed approach, accurate voltage/current distribution with temperature effect as well as temperature distribution with Joule heating effect can be obtained efficiently. By ensuring smoothly stretched gridding between die region and package region, fast convergence of multigrid method can be reached for both DC voltage drop and thermal simulations. The effect of nonuniform gridding on the convergence of multigrid is studied. The temperature effect on voltage drop and Joule heating effect on localized hotspot are discussed.

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Y2 - 29 May 2012 through 1 June 2012

ER -

Fast electrical-thermal co-simulation using multigrid method for 3D integration

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