TY - GEN
T1 - Filter integration in ultra thin organic substrate via 3D stitched capacitor
AU - Min, Sunghwan
AU - Hwang, Seunghyun
AU - Chung, Daehyun
AU - Swaminathan, Madhavan
AU - Sridharan, Vivek
AU - Chan, Hunter
AU - Liu, Fuhan
AU - Sundaram, Venky
AU - Tummala, Rao R.
PY - 2009
Y1 - 2009
N2 - This paper presents filters integrated in ultra thin multilayer organic substrate using 3D stitched capacitor alleviating shunt parasitics and providing tunable capacitors. Insertion loss of less than 2.2dB, return loss of greater than 15dB at 2.4 GHz and attenuation of greater than 30dB below 2.0 GHz and at 4.7 GHz were measured. The measured results showed good agreement with simulated results. This paper demonstrated 2.4 GHz bandpass filters with size of 2.2mm x 3.0mm x 0.2mm (1.2mm3) in ultra thin organic RXP substrate.
AB - This paper presents filters integrated in ultra thin multilayer organic substrate using 3D stitched capacitor alleviating shunt parasitics and providing tunable capacitors. Insertion loss of less than 2.2dB, return loss of greater than 15dB at 2.4 GHz and attenuation of greater than 30dB below 2.0 GHz and at 4.7 GHz were measured. The measured results showed good agreement with simulated results. This paper demonstrated 2.4 GHz bandpass filters with size of 2.2mm x 3.0mm x 0.2mm (1.2mm3) in ultra thin organic RXP substrate.
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U2 - 10.1109/EDAPS.2009.5404004
DO - 10.1109/EDAPS.2009.5404004
M3 - Conference contribution
AN - SCOPUS:77950190730
SN - 9781424453504
T3 - 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009
BT - 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009
T2 - 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009
Y2 - 2 December 2009 through 4 December 2009
ER -