Filter integration in ultra thin organic substrate via 3D stitched capacitor

Sunghwan Min; Seunghyun Hwang; Daehyun Chung; Madhavan Swaminathan; Vivek Sridharan; Hunter Chan; Fuhan Liu; Venky Sundaram; Rao R. Tummala

doi:10.1109/EDAPS.2009.5404004

Filter integration in ultra thin organic substrate via 3D stitched capacitor

Sunghwan Min, Seunghyun Hwang, Daehyun Chung, Madhavan Swaminathan, Vivek Sridharan, Hunter Chan, Fuhan Liu, Venky Sundaram, Rao R. Tummala

Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

9 Scopus citations

Abstract

This paper presents filters integrated in ultra thin multilayer organic substrate using 3D stitched capacitor alleviating shunt parasitics and providing tunable capacitors. Insertion loss of less than 2.2dB, return loss of greater than 15dB at 2.4 GHz and attenuation of greater than 30dB below 2.0 GHz and at 4.7 GHz were measured. The measured results showed good agreement with simulated results. This paper demonstrated 2.4 GHz bandpass filters with size of 2.2mm x 3.0mm x 0.2mm (1.2mm³) in ultra thin organic RXP substrate.

Original language	English (US)
Title of host publication	2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009
DOIs	https://doi.org/10.1109/EDAPS.2009.5404004
State	Published - 2009
Event	2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009 - Shatin, Hong Kong, China Duration: Dec 2 2009 → Dec 4 2009

Publication series

Name	2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009

Conference

Conference	2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009
Country/Territory	China
City	Shatin, Hong Kong
Period	12/2/09 → 12/4/09

All Science Journal Classification (ASJC) codes

Hardware and Architecture
Electrical and Electronic Engineering

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10.1109/EDAPS.2009.5404004

Cite this

Min, S., Hwang, S., Chung, D., Swaminathan, M., Sridharan, V., Chan, H., Liu, F., Sundaram, V., & Tummala, R. R. (2009). Filter integration in ultra thin organic substrate via 3D stitched capacitor. In 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009 Article 5404004 (2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009). https://doi.org/10.1109/EDAPS.2009.5404004

@inproceedings{eb256999999147a599cbc207a09050b4,

title = "Filter integration in ultra thin organic substrate via 3D stitched capacitor",

abstract = "This paper presents filters integrated in ultra thin multilayer organic substrate using 3D stitched capacitor alleviating shunt parasitics and providing tunable capacitors. Insertion loss of less than 2.2dB, return loss of greater than 15dB at 2.4 GHz and attenuation of greater than 30dB below 2.0 GHz and at 4.7 GHz were measured. The measured results showed good agreement with simulated results. This paper demonstrated 2.4 GHz bandpass filters with size of 2.2mm x 3.0mm x 0.2mm (1.2mm3) in ultra thin organic RXP substrate.",

author = "Sunghwan Min and Seunghyun Hwang and Daehyun Chung and Madhavan Swaminathan and Vivek Sridharan and Hunter Chan and Fuhan Liu and Venky Sundaram and Tummala, {Rao R.}",

year = "2009",

doi = "10.1109/EDAPS.2009.5404004",

language = "English (US)",

isbn = "9781424453504",

series = "2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009",

booktitle = "2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009",

note = "2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009 ; Conference date: 02-12-2009 Through 04-12-2009",

}

Min, S, Hwang, S, Chung, D, Swaminathan, M, Sridharan, V, Chan, H, Liu, F, Sundaram, V & Tummala, RR 2009, Filter integration in ultra thin organic substrate via 3D stitched capacitor. in 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009., 5404004, 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009, 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009, Shatin, Hong Kong, China, 12/2/09. https://doi.org/10.1109/EDAPS.2009.5404004

Filter integration in ultra thin organic substrate via 3D stitched capacitor. / Min, Sunghwan; Hwang, Seunghyun; Chung, Daehyun et al.
2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009. 2009. 5404004 (2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Filter integration in ultra thin organic substrate via 3D stitched capacitor

AU - Min, Sunghwan

AU - Hwang, Seunghyun

AU - Chung, Daehyun

AU - Swaminathan, Madhavan

AU - Sridharan, Vivek

AU - Chan, Hunter

AU - Liu, Fuhan

AU - Sundaram, Venky

AU - Tummala, Rao R.

PY - 2009

Y1 - 2009

N2 - This paper presents filters integrated in ultra thin multilayer organic substrate using 3D stitched capacitor alleviating shunt parasitics and providing tunable capacitors. Insertion loss of less than 2.2dB, return loss of greater than 15dB at 2.4 GHz and attenuation of greater than 30dB below 2.0 GHz and at 4.7 GHz were measured. The measured results showed good agreement with simulated results. This paper demonstrated 2.4 GHz bandpass filters with size of 2.2mm x 3.0mm x 0.2mm (1.2mm3) in ultra thin organic RXP substrate.

AB - This paper presents filters integrated in ultra thin multilayer organic substrate using 3D stitched capacitor alleviating shunt parasitics and providing tunable capacitors. Insertion loss of less than 2.2dB, return loss of greater than 15dB at 2.4 GHz and attenuation of greater than 30dB below 2.0 GHz and at 4.7 GHz were measured. The measured results showed good agreement with simulated results. This paper demonstrated 2.4 GHz bandpass filters with size of 2.2mm x 3.0mm x 0.2mm (1.2mm3) in ultra thin organic RXP substrate.

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M3 - Conference contribution

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SN - 9781424453504

T3 - 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009

BT - 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009

T2 - 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009

Y2 - 2 December 2009 through 4 December 2009

ER -

Filter integration in ultra thin organic substrate via 3D stitched capacitor

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