TY - GEN
T1 - Finite-difference modeling of noise coupling between power/ground planes in multilayered packages and boards
AU - Ege Engin, A.
AU - Bharath, Krishna
AU - Swaminathan, Madhavan
AU - Cases, Moises
AU - Mutnury, Bhyrav
AU - Pham, Nam
AU - De Araujo, Daniel N.
AU - Matoglu, Erdem
PY - 2006
Y1 - 2006
N2 - Multilayered packages and boards, such as high performance server boards, contain thousands of signal lines, which have to be routed on and through several layers with power/ground planes in between. There can be noise coupling not only in the transversal direction through the power/ground planes in such a structure, but also vertically from one plane pair to another through the apertures and via holes. In addition, the continuous increase in power demand along with reduced Vdd values results in significant current requirement for the future chips. Hence, the parasitic effects of the power distribution system become increasingly more critical regarding the signal integrity and electromagnetic interference properties of cost-effective high-performance designs. We present a multilayer finite-difference method (M-FDM), which is capable of characterizing such noise coupling mechanisms. This method allows to consider realistic structures, which would be prohibitive to simulate using full-wave simulators.
AB - Multilayered packages and boards, such as high performance server boards, contain thousands of signal lines, which have to be routed on and through several layers with power/ground planes in between. There can be noise coupling not only in the transversal direction through the power/ground planes in such a structure, but also vertically from one plane pair to another through the apertures and via holes. In addition, the continuous increase in power demand along with reduced Vdd values results in significant current requirement for the future chips. Hence, the parasitic effects of the power distribution system become increasingly more critical regarding the signal integrity and electromagnetic interference properties of cost-effective high-performance designs. We present a multilayer finite-difference method (M-FDM), which is capable of characterizing such noise coupling mechanisms. This method allows to consider realistic structures, which would be prohibitive to simulate using full-wave simulators.
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U2 - 10.1109/ECTC.2006.1645815
DO - 10.1109/ECTC.2006.1645815
M3 - Conference contribution
AN - SCOPUS:33845563686
SN - 1424401526
SN - 9781424401529
T3 - Proceedings - Electronic Components and Technology Conference
SP - 1262
EP - 1267
BT - Proceedings - IEEE 56th Electronic Components and Technology Conference
T2 - IEEE 56th Electronic Components and Technology Conference
Y2 - 30 May 2006 through 2 June 2006
ER -