First Demonstration of Vertical 2T-nC FeRAM Hybrid Cell and Its Scalability for High-Density 3D Ferroelectric Capacitor Memory

Shan Deng, Yi Xiao, Zhouhang Jiang, Yixin Qin, Zijian Zhao, Renzheng Zhang, John Howe, Yushan Lee, Jiahui Duan, Rajiv Joshi, Thomas Kampfe, Tengfei Luo, Tuo Hung Hou, Xiao Gong, Vijaykrishnan Narayanan, Kai Ni

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this work, we perform a comprehensive experimental and modeling study into the scaling of vertical 2T-nC ferroelectric random-access memory (FeRAM) hybrid cell to demonstrate a high performance and high-density 3D capacitor memory. We demonstrate: i) first time successful integration of the vertical 2T-3C FeRAM cell by stacking the vertical metal-ferroelectric-metal (MFM) stack on top of Si CMOS transistors; ii) successful experimental operation of the memory cell, including the quasi-nondestructive read out (QNRO) of the polarization without write back after 106 read cycles; iii) the write bit line (WBL) heavily screens the coupling between neighboring strings, making it a minor concern; v) aggressive stacking of the WBLs, i.e., number of MFMs in a string, could facilitate the self-boosting during write operation due to ferroelectric linear capacitance (CFE), which allows self-boosted inhibition for VW/2 scheme and worsens the VW/3 scheme as disturb increases to intolerable 2VW/3; v) aggressive horizontal scaling significantly increases the read disturb to cells on neighboring planes due to capacitance between two WBLs (CZ).

Original languageEnglish (US)
Title of host publication2024 IEEE International Electron Devices Meeting, IEDM 2024
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798350365429
DOIs
StatePublished - 2024
Event2024 IEEE International Electron Devices Meeting, IEDM 2024 - San Francisco, United States
Duration: Dec 7 2024Dec 11 2024

Publication series

NameTechnical Digest - International Electron Devices Meeting, IEDM
ISSN (Print)0163-1918

Conference

Conference2024 IEEE International Electron Devices Meeting, IEDM 2024
Country/TerritoryUnited States
CitySan Francisco
Period12/7/2412/11/24

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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