Flexible and lithography-compatible copper foil substrates for ferroelectric thin films

B. Laughlin, J. F. Ihlefeld, Patrick Daniels, J. P. Maria

Research output: Contribution to journalArticlepeer-review

4 Scopus citations


A process has been developed for preparing a low surface roughness copper foil by evaporation and subsequent peel-off of copper metal layers on glass slides. These 15 micron thick substrates exhibited roughness values between 1 and 2 nm root-mean-square (RMS) and 9 nm RMS over 25 μm2 and 100 μm2 analysis areas, respectively. The deposition and crystallization of barium strontium titanate layers were demonstrated on these smoother variant foils. The fully processed dielectric layers exhibited field tunability greater than 5:1, and could withstand fields in excess of 750 kV/cm. High field loss tangents below 0.007 were observed, making these materials excellent candidates for microwave devices. Finally, a process of lamination and contact lithography was used to demonstrate patterning of micron-scale features suitable for microwave circuit element designs.

Original languageEnglish (US)
Pages (from-to)3294-3297
Number of pages4
JournalThin Solid Films
Issue number10
StatePublished - Mar 31 2008

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry


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