Foreword

Ping Sheng; Chun Liu; Tiezheng Qian; Xiaoping Wang

doi:10.1016/j.ssc.2010.01.015

Foreword

Ping Sheng
, Chun Liu
, Tiezheng Qian
, Xiaoping Wang

Research output: Contribution to journal › Editorial › peer-review

Original language	English (US)
Pages (from-to)	967
Number of pages	1
Journal	Solid State Communications
Volume	150
Issue number	21-22
DOIs	https://doi.org/10.1016/j.ssc.2010.01.015
State	Published - Jun 2010

All Science Journal Classification (ASJC) codes

General Chemistry
Condensed Matter Physics
Materials Chemistry

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10.1016/j.ssc.2010.01.015

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@article{a263e28941014570bf8ba09df5e25173,

title = "Foreword",

author = "Ping Sheng and Chun Liu and Tiezheng Qian and Xiaoping Wang",

year = "2010",

month = jun,

doi = "10.1016/j.ssc.2010.01.015",

language = "English (US)",

volume = "150",

pages = "967",

journal = "Solid State Communications",

issn = "0038-1098",

publisher = "Elsevier Ltd",

number = "21-22",

}

TY - JOUR

T1 - Foreword

AU - Sheng, Ping

AU - Liu, Chun

AU - Qian, Tiezheng

AU - Wang, Xiaoping

PY - 2010/6

Y1 - 2010/6

UR - https://www.scopus.com/pages/publications/77951005896

UR - https://www.scopus.com/pages/publications/77951005896#tab=citedBy

U2 - 10.1016/j.ssc.2010.01.015

DO - 10.1016/j.ssc.2010.01.015

M3 - Editorial

AN - SCOPUS:77951005896

SN - 0038-1098

VL - 150

SP - 967

JO - Solid State Communications

JF - Solid State Communications

IS - 21-22

ER -

Foreword

All Science Journal Classification (ASJC) codes

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