Foreword

Research output: Contribution to journal › Editorial › peer-review

Original language	English (US)
Article number	7893093
Pages (from-to)	iii
Journal	2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016
DOIs	https://doi.org/10.1109/EDAPS.2016.7893093
State	Published - Apr 5 2017
Event	2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016 - Honolulu, United States Duration: Dec 14 2016 → Dec 16 2016

All Science Journal Classification (ASJC) codes

@article{9c254dea370645ca86ba45037c5a799c,

title = "Foreword",

author = "Jos{\'e} Schutt-Ain{\'e} and Madhavan Swaminathan",

year = "2017",

month = apr,

day = "5",

doi = "10.1109/EDAPS.2016.7893093",

language = "English (US)",

pages = "iii",

journal = "2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016",

note = "2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016 ; Conference date: 14-12-2016 Through 16-12-2016",

}

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AU - Schutt-Ainé, José

AU - Swaminathan, Madhavan

PY - 2017/4/5

Y1 - 2017/4/5

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DO - 10.1109/EDAPS.2016.7893093

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AN - SCOPUS:85018374600

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JO - 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016

JF - 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016

M1 - 7893093

T2 - 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016

Y2 - 14 December 2016 through 16 December 2016

ER -