Abstract
This paper describes the modeling and measurement of VSPA, a very small peripheral array package developed by Archistrat containing 320 pins with a size of 27 mm × 27 mm. The analysis covers a frequency range of 20 Mhz - 3 Ghz, includes analytical calculations, simulations, measurements, leading to a lumped model representation of the package parasitics.
| Original language | English (US) |
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| Pages | 133-136 |
| Number of pages | 4 |
| State | Published - 1995 |
| Event | Proceedings of the IEEE 4th Topical Meeting on Electrical Performance of Electronic Packaging - Portland, OR, USA Duration: Oct 2 1995 → Oct 4 1995 |
Conference
| Conference | Proceedings of the IEEE 4th Topical Meeting on Electrical Performance of Electronic Packaging |
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| City | Portland, OR, USA |
| Period | 10/2/95 → 10/4/95 |
All Science Journal Classification (ASJC) codes
- General Engineering