Frictional effects of interface bonding energy in blister testing

M. Zheng, Y. J. Su, L. Q. Chen, T. Y. Zhang

Research output: Contribution to journalArticlepeer-review

12 Scopus citations


Blister tests are used to investigate the size effect on the critical energy release rate for the onset of debonding of interfaces between commercial tape and plain steel. The measured data display a size effect if the interfacial friction is not taken into account. A proportional displacement model is thus proposed to simultaneously evaluate the critical energy release rate and the frictional parameter. Theory and experiment give a critical energy release rate of 1.9956 Pa m for the onset of interfacial debonding between the commercial tape and the plain steel and it is independent of the blister size.

Original languageEnglish (US)
Pages (from-to)75-80
Number of pages6
JournalTheoretical and Applied Fracture Mechanics
Issue number2
StatePublished - 1999

All Science Journal Classification (ASJC) codes

  • General Materials Science
  • Condensed Matter Physics
  • Mechanical Engineering
  • Applied Mathematics


Dive into the research topics of 'Frictional effects of interface bonding energy in blister testing'. Together they form a unique fingerprint.

Cite this