FTIR measurements of compositional heterogeneities

Shuhui Kang, Bryan D. Vogt, Wen Li Wu, Vivek M. Prabhu, David L. VanderHart, Ashwin Rao, Eric K. Lin, Karen Turnquest

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations


A general approach to characterize compositional heterogeneity in polymer thin films using Fourier transform infrared (FTIR) spectroscopy has been demonstrated Polymer films with varying degrees of heterogeneity were prepared using a model chemically amplified photoresist where a photoacid catalyzed reaction-diffusion process results in the formation of methacrylic acid (MAA)-rich domains. Within these domains, the carboxylic acid groups dimenze through hydrogen bonding. FTIR measurements of the relative fraction of hydrogen-bonded versus free carboxylic groups are used to quantify the degree of compositional heterogeneity. It was shown that the degree of the spatial heterogeneity varies with changes in the deprotection level and initial copolymer composition. The degree of heterogeneity is small at very low and very high deprotection level and maximize when the deprotection level is around 0.25. Increased non-reactive comonomer content decreases the degree of heterogeneity by reducing the hydrogen bonding efficiency.

Original languageEnglish (US)
Title of host publicationAdvances in Resist Materials and Processing Technology XXIV
EditionPART 1
StatePublished - Oct 15 2007
EventAdvances in Resist Materials and Processing Technology XXIV - San Jose, CA, United States
Duration: Feb 26 2007Feb 28 2007

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
NumberPART 1
ISSN (Print)0277-786X


ConferenceAdvances in Resist Materials and Processing Technology XXIV
Country/TerritoryUnited States
CitySan Jose, CA

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering


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