TY - GEN
T1 - Fully Rubbery Epicardial Bioelectronic Patch
AU - Ershad, Faheem
AU - Sim, Kyoseung
AU - Yu, Cunjiang
N1 - Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - The ideal epicardial bioelectronic patch should possess a cardiac tissue-like mechanical softness and deformability, and capability of spatiotemporal mapping of electrical and physical parameters. However, existing patches constructed from rigid materials with structurally engineered mechanical stretchability still form a hard-soft interface with the epicardium, which can strain cardiac tissue and does not allow for deformation with a beating heart. Alternatively, patches made from intrinsically soft materials lack spatiotemporal mapping or sensing capabilities. Here, we report the first epicardial bioelectronic patch that is made from materials that match the mechanical softness of heart tissue and is capable of multiplexed ECG mapping, strain and temperature sensing, electrical pacing, thermal ablation, and energy harvesting functions.
AB - The ideal epicardial bioelectronic patch should possess a cardiac tissue-like mechanical softness and deformability, and capability of spatiotemporal mapping of electrical and physical parameters. However, existing patches constructed from rigid materials with structurally engineered mechanical stretchability still form a hard-soft interface with the epicardium, which can strain cardiac tissue and does not allow for deformation with a beating heart. Alternatively, patches made from intrinsically soft materials lack spatiotemporal mapping or sensing capabilities. Here, we report the first epicardial bioelectronic patch that is made from materials that match the mechanical softness of heart tissue and is capable of multiplexed ECG mapping, strain and temperature sensing, electrical pacing, thermal ablation, and energy harvesting functions.
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U2 - 10.1109/MEMS51670.2022.9699582
DO - 10.1109/MEMS51670.2022.9699582
M3 - Conference contribution
AN - SCOPUS:85126395412
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 39
EP - 42
BT - 35th IEEE International Conference on Micro Electro Mechanical Systems Conference, MEMS 2022
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 35th IEEE International Conference on Micro Electro Mechanical Systems Conference, MEMS 2022
Y2 - 9 January 2022 through 13 January 2022
ER -